Technology Articles

2025-03 Semiconductors Texas Instruments

[Mar 20 2025] Texas Instruments has introduced a global microminiature MCU, further expanding its full portfolio of Arm® Cortex®-M0+ MSPM0 MCUS. The MSPM0C1104 MCU is in a wafer-on-chip package (WCSP) measuring just 1.38mm2, or about the size of a black peppercorn-allowing designers to optimize the layout space for compact applications such as medical wearables and personal electronics without compromising per ...

2025-03 Sensors Melexis Technologies NV

[Mar 19 2025] Melexis announced the MLX80142 dual RGB LED driver chip (six channels) as the latest member of the MelEXis Intelligent state Machine LED driver chip family, which is the first product to support the MeLiBu 2.0 protocol. The chip not only features Milai's proven LED driver technology, but also supports code-free options and is designed for the next generation of smart RGB lighting applications. In ...

2025-03 Semiconductors ON Semiconductor

[Mar 19 2025] Onsemi introduces the first generation of its SPM 31 smart Power module (IPM) family based on 1200V silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET). The EliteSiC SPM 31 IPM offers superior energy efficiency and power density in an ultra-compact package size compared to the use of 7th generation Field Cut-off (FS7) IGBT technology, resulting in a lower overall syst ...

2025-03 Semiconductors Amphenol Advanced Sensors

[Mar 18 2025] In modern power system, the accurate detection and monitoring of current is the key to ensure the safe operation of equipment. Whether it is industrial automation, energy management, electric vehicles or renewable energy systems, accurate current measurement is particularly important. However, there are many problems in the accuracy, response speed and durability of traditional current sensors, w ...

2025-03 Power Infineon Technologies

[Mar 18 2025] Infineon Technologies AG has announced a roadmap for a new generation of AI data center battery backup Unit (BBU) solutions to ensure uninterrupted operation of AI data centers and avoid the risk of power outages and data loss. This comprehensive BBU roadmap includes power solutions from 4 kW to the world's first 12 kW BBU. The BBU solution delivers efficient, stable, and scalable power conversio ...

2025-03 Passive Components Infineon Technologies

[Mar 18 2025] Many industrial applications are now moving towards higher power levels with minimal power losses, and one way to achieve this is to increase the DC bus voltage. In response to this market trend, Infineon Technologies AG, the global semiconductor leader in power systems and the Internet of Things, launched the CoolSiC™ Schottky Diode 2000 V G5 product family in September 2024, the first silicon c ...

2025-03 Semiconductors Toshiba Semiconductor and Storage

[Mar 17 2025] Toshiba Electronic Components and Memory Devices Corporation announced the mass production of the "TB9103FTG" gate drive IC for automotive DC brushed motor applications, typical applications include latching motors and locking motors for electric rear doors and electric sliding doors, and drive motors for electric Windows and electric seats. Automotive components are now largely electrified, and ...

2025-03 Semiconductors Qorvo US Inc.

[Mar 17 2025] Qorvo, the world's leading provider of connectivity and power solutions, announced the launch of its first fully integrated low-power ultra-wideband (UWB) system-on-chip (SoC), the QM35825, further expanding its UWB portfolio. This high-performance, ultra-low-power SoC leverages radar-based sensing technology to enable precise location tracking for applications such as automated presence detectio ...

2025-03 Semiconductors Nidec Copal Electronics

[Mar 17 2025] Japanese technology company ViXion Inc. has unveiled a smart glasses solution with automatic focus adjustment for both short - and far-sightedness, while being as light as regular glasses. ViXion01S responds to a variety of visual challenges, including presbyopia (farsightedness) and nearsightedness (myopia). Weighing just 33 grams (without the outer frame lenses), the glasses measure the target ...

2025-03 Power Qualcomm

[Mar 14 2025] Qualcomm Technologies continues to set a new benchmark for connectivity, announcing the launch of Qualcomm X85 5G Modem and RF, the company's eighth generation 5G modem to antenna solution and the company's fourth generation AI-enabled 5G connectivity system. Designed for a new generation of connected and AI-enabled applications, the Qualcomm X85 delivers faster speeds to support seamless streami ...

2025-03 Semiconductors Silicon Labs

[Mar 14 2025] Silicon Labs, a global leader in building a more connected world with secure, intelligent wireless connectivity technologies, announced that its MG26 series of wireless system-on-chip (SOCs) are now fully available through Chips and its distribution partners. As the industry's most advanced, high-performance Matter and concurrent multi-protocol solution to date, the MG26 SoC has twice the flash a ...

2025-03 Semiconductors Lattice Semiconductor Corporation

[Mar 14 2025] As with many types of devices, it's easy to fall into the trap of thinking that big chips are better and more impactful than small ones. However, when it comes to FPgas (field-programmable gate arrays), smaller chips tend to have the greatest application range and impact. Small FPgas are used in a wide variety of devices, applications, and industries because of their ability to reliably perform c ...