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Technology Articles

Records 3,183
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ON Semiconductor introduces advanced depth sensors for industrial applications

2025-03 Semiconductors ON Semiconductor
[Mar 13 2025] Onsemi has introduced its first real-time, indirect time-of-flight (iToF) sensor, the Hyperlux™ ID series, for high-precision long-range measurements and three-dimensional imaging of fast-moving objects. The Hyperlux ID series features On's new proprietary global shutter pixel architecture and built-in storage to capture the full scene while taking real-time depth measurements. This innovative ap ...
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Infineon introduces a new generation of high-power density power modules that enable vertical power supply for AI data centers

2025-03 Connectors Infineon Technologies
[Mar 13 2025] Infineon Technologies AG, the global semiconductor leader in power systems and the Internet of Things, has announced the launch of a new generation of high-density power modules that will play a key role in enabling AI and high-performance computing. The new OptiMOS™ TDM2454xx four-phase power module delivers industry-leading power density and reduced total cost of ownership (TCO) for AI data cen ...
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Infineon introduced RISC-V to the automotive industry and will be the first to introduce the automotive-grade RISC-V MCU family

2025-03 Connectors Infineon Technologies
[Mar 11 2025] Infineon Technologies AG will launch a new family of automotive microcontrollers (MCUS) based on RISC-V in the next few years, leading the adoption of RISC-V in the automotive industry. The new family will be integrated into Infineon's established automotive MCU brand AURIX™, expanding the company's current automotive MCU portfolio based on TriCore™ (AURIX™ TC family) and Arm® (TRAVEO™ family, PS ...
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Renesas introduces certified PROFINET-IRT and PROFIdrive software protocol stacks for RZ/T and RZ/N series microprocessors

2025-03 Semiconductors Renesas Electronics America
[Mar 11 2025] Renesas Electronics today announced the availability of certified PROFINET IRT and PROFIdrive software protocol stacks for its RZ/T and RZ/N series of industrial network system microprocessors (MPUs). The initial software version is suitable for RZ/T2M MPUs designed for servo motor control applications, as well as RZ/N2L for Industrial iot gateway applications such as remote IO or industrial Ethe ...
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Renesas and Altium jointly launch "Renesas 365 Powered by Altium"

2025-03 Semiconductors Renesas Electronics America
[Mar 8 2025] Renesas Electronics, together with Altium, a global provider of advanced electronics design software, announced the launch of Renesas 365 Powered by Altium (" Renesas 365 "), a pioneering solution for the electronics industry. Designed to optimize the entire process of electronic development from chip selection to system lifecycle management. The transformative solution will be unveiled at the Em ...
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Tektronix helps Magway build a zero-emission underground distribution system, leading the new revolution in logistics

2025-03 Semiconductors Telcodium Inc.
[Mar 8 2025] Magway, an innovative company based in Wembley, London, is developing a forward-thinking logistics distribution system. The system moves packages and goods efficiently through a network of underground pipes across the UK, using small carriages that run on tracks. Its core technologies include traditional high density polyethylene (HDPE) tubes and advanced linear synchronous motors. Challenge Magw ...
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A family of compact grid drive transformers designed for 500v systems

2025-03 Connectors TDK
[Mar 7 2025] TDK Corporation introduces the EPCOS EP9 series (ordering code: B82804E), a more compact alternative to the existing E10EM series of surface-mount transformers, specifically designed for IGBT and FET gate driver circuits. Optimized for high-performance applications in e-mobility and industrial systems operating at 500 V, these transformers provide superior insulation, minimal coupling capacitance ...
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Power Integrations introduces new LLC Switcher IC with 1650 W continuous output capability

2025-03 Power Power Integrations
[Mar 7 2025] Power Integrations has announced a significant triplication of the power output of its HiperLCS™-2 chipset. Utilizing advanced half-bridge switching technology and innovative package design, the new device delivers up to 1650 W of continuous output power while maintaining over 98% efficiency. Designed for industrial power supplies, as well as chargers for electric scooters and outdoor power tools ...
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Onsemi intends to acquire Allegro MicroSystems

2025-03 Semiconductors ON Semiconductor
[Mar 7 2025] Onsemi has made public its proposal to acquire Allegro MicroSystems for $35.10 per share in cash, valuing the company at about $6.9 billion. onsemi had been in negotiations with Allegro for several months and submitted its latest offer on February 12, 2025, an increase from its initial offer of $34.50 per share in September 2024. Onsemi claims that by combining two very complementary companies, t ...
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OmniOn Power™ introduces the Osprey family of non-isolated bus converters for AI server applications

2025-03 Semiconductors OmniVision Technologies Inc
[Mar 6 2025] To meet the growing power requirements of applications such as artificial intelligence (AI), Large Language models (llm) and machine learning (ML), OmniOn power™ has introduced a new line of high-power, non-isolated DC/DC bus converters, the Osprey family. The product line includes 2kW (kW) QODE167A0B, 1.6 kW QODE136A0B and 1.3 kW QODE108A0B modules, of which the 2kW variant is currently one of t ...
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STMicroelectronics Introduces High Efficiency micro monolithic buck converter

2025-03 Connectors STMicroelectronics
[Mar 6 2025] The DCP3601 from ST is a compact monolithic buck converter that integrates a wide range of functions and offers superior flexibility for streamlined, low bom design and high conversion efficiency. By integrating the built-in power switch and compensation, it requires only six external components - inductors, self-bootstrap, filter capacitors, and feedback resistors to set the output voltage - sim ...
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Rohm introduces the 650V GaN HEMT in a compact TOLL package with excellent heat dissipation

2025-03 Semiconductors Rohm Semiconductor
[Mar 6 2025] ROHM introduced the 650V GaN hemt in a TOLL (TO-LeadLess) package with the newly developed GNP2070TD-Z. With a compact design and superior heat dissipation, the package offers high current capacity and superior switching performance. As a result, TOLL packaging is becoming increasingly popular in applications that require robust power processing, especially in industrial equipment and automotive ...