Technology Articles
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Molex announces Brad Micro-Push M12 connectors for factory automation and industrial lighting applications
2015-06
Connectors
Molex
[Jun 17 2015] Molex Corporation announces Brad Micro-Push M12 connectors for factory automation and industrial lighting applications. The connector is equipped with an innovative push-in and push-out interface, which reduces installation time by up to 80% compared to screw connectors, and allows convenient blind insertion connections in limited Spaces. The solution is constructed without any metal components t ...
Dialog introduces two power control IC products
2015-06
Connectors
Dialog Semiconductor GmbH
[Jun 17 2015] Dialog Semiconductor Corporation announced the launch of two power control ics, the iW1818 and iW1830, which not only significantly improve the reliability of white goods power systems, but also reduce material (BOM) costs. These two digital power control ics can be used in dishwashers, refrigerators, stoves, microwave ovens, and other high-volume home appliance systems. The white goods market is ...
Broadcom has introduced a new Bluetooth Smart system-on-a-chip (SoC) product
2015-06
Power
Broadcom
[Jun 16 2015] Broadcom announced the launch of a new Bluetooth Smart system-on-a-chip (SoC) product, adding to its Wireless Internet Connectivity for Embedded Devices (WICED™) portfolio. Broadcom's WICED Smart Ready SoC doubles speed over Bluetooth Smart connections, dramatically improving performance and extending the battery life of Internet of Things (IoT) devices. By integrating Bluetooth and Bluetooth Sma ...
Renesas Multi-function microcontroller RL78 / G1F adds 20 new members
2015-06
Connectors
Renesas Electronics America
[Jun 16 2015] Renesas Electronics announces the multi-function microcontroller RL78 / G1F Group Controller (MCU), adding 20 new members to the low-power RL78 family of MCUS. The entire RL78 / G1X series MCU features enhanced peripheral functionality and compatibility, and the new device simplifies sensorless brushless direct current motor (BLDC motor) control to provide precise operation at faster rotation spe ...
Power Integrations announced the launch of the next generation of its CAPZero family of innovative double-terminal X capacitor discharge ics
2015-06
Power
Power Integrations
[Jun 15 2015] Power Integrations announced the launch of the CAPZero™-2 IC, the next generation device in its CAPZero family of innovative double-terminal X-capacitor discharge ics. The CAPZero-2 IC covers a wide range of applications and output power for increased design flexibility. Covering a wide range of X capacitors from 0.1 µF to 6 µF, and with a breakdown voltage rated at 1 kV to withstand transient vo ...
Vishay introduces new SMD packaged ultra-thin drives
2015-06
Passive Components
Vishay
[Jun 15 2015] Vishay Intertechnology has announced the launch of the VOL3120, an ultra-thin 2.5A IGBT and MOSFET driver in a new SMD package. Vishay Semiconductors is a small footprint with a height of 2.5mm and a minimum clearance and external creepage distance of 8mm. In addition to its small size, the high isolation voltage of the VIORM and VIOTM, 1050V and 8000V respectively, makes it ideal for operating a ...
ON Semiconductor introduces a full line of double data Rate (DDR) terminal regulators
2015-06
Semiconductors
ON Semiconductor
[Jun 14 2015] ON Semiconductor further strengthens its Low Voltage drop (LDO) linear regulator portfolio with a new series of high-performance devices to support double data rate (DDR) memory. NCP51200, NCP51400, NCP51510 and NCP51199 use built-in power MOSFETs, Specific applications such as SDRAM DIMM memory, servers, routers, smartphones, tablet platforms, set-top boxes, smart TVS, printers and PC/laptop mot ...
Cypress introduces high-performance synchronous SRAM with on-chip error correction codes
2015-06
Semiconductors
Cypress Semiconductor
[Jun 14 2015] Cypress Semiconductor Corporation announced the industry's highest capacity synchronous SRAM with on-chip error correction code (ECC). The new 36Mb synchronous SRAM integrates ECC capabilities to provide the highest level of data reliability and simplify the design of a variety of military, communications and data processing applications. Cypress plans to expand its synchronous SRAM line with ECC ...
Artesyn Embedded Technologies introduces new DC power converters
2015-06
Power
Artesyn Embedded Technologies
[Jun 13 2015] Artesyn Embedded Technologies has announced the introduction of the new ADQ600 Series 600W 1/4 brick isolated DC/DC power converters, which are characterized by high efficiency and extreme heat dissipation to meet the specifications of telecommunications networks and data center infrastructure. Equipped with a fully regulated 12V output, this series of power converters can provide up to 50A outpu ...
SanDisk introduces the new SanDisk SSD Z400s
2015-06
Power
SanDisk
[Jun 13 2015] Sandisk Corporation, the world's leading provider of flash storage solutions, announced the launch of the new Z400s SSD, a cost-effective solid-state drive (SSD) designed to replace traditional hard disks (HDDS) in computing platforms and embedded applications. To meet business needs, PCS and embedded systems need stable and reliable access to memory. The Z400s offers 20 times the performance and ...
Infineon Technologies introduces the new CoolMOS C7 series superjunction (SJ) MOSFETs family
2015-06
Power
Infineon Technologies
[Jun 12 2015] Infineon Technologies introduces the new CoolMOS™ C7 series superjunction (SJ) MOSFET family. The 600 V series reduces switching losses by 50% compared to CoolMOS™ CP and achieves similar performance levels to GaN in PFC, TTF and other hard switching topologies. The CoolMOS C7 is the first in the industry to achieve an area specific resistance (RDS(ON)*A) of 1 Ω/mm2, which further expands Infineo ...
ST introduces new powerSTEP motor drives
2015-06
Connectors
STMicroelectronics
[Jun 12 2015] ST introduces the new powerSTEP motor driver, a sophisticated motor control design that enables applications to perform high-power work directly on the chip. This fully integrated stepper motor driver System Package (SiP) offers the industry's highest power density of up to 500W/cm2 and will assist automation equipment manufacturers in designing cost-effective motor control systems. Improve perfo ...