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Broadcom has introduced a new Bluetooth Smart system-on-a-chip (SoC) product

Jun 16 2015 2015-06 Power Broadcom
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Broadcom announced the launch of a new Bluetooth Smart system-on-a-chip (SoC) product, adding to its Wireless Internet Connectivity for Embedded Devices (WICED™) portfolio. Broadcom's WICED Smart Ready SoC doubles speed over Bluetooth Smart connections, dramatically improving performance and extending the battery life of Internet of Things (IoT) devices.

     Broadcom announced the launch of a new Bluetooth Smart system-on-a-chip (SoC) product, adding to its Wireless Internet Connectivity for Embedded Devices (WICED™) portfolio. Broadcom's WICED Smart Ready SoC doubles speed over Bluetooth Smart connections, dramatically improving performance and extending the battery life of Internet of Things (IoT) devices. 

     By integrating Bluetooth and Bluetooth Smart on a single chip with a built-in microcontroller (MCU), the BCM20706 can reduce costs, reduce package size, and help companies in home automation, audio, industrial, wearable and other applications accelerate the time-to-market process. Broadcom's WICED Smart Ready SoC also offers dual-mode Bluetooth and Bluetooth Smart applications, allowing original equipment manufacturers (Oems) to choose the right technology based on their end-product needs. In addition, thanks to the doubling of data rates over Bluetooth Smart connectivity, Broadcom's WICED platform will be able to adapt to future needs, supporting high data rates and an energy-efficient 2 Mbps mode. It is expected that this mode will be incorporated into the Bluetooth 5.0 standard.

     Brian Bedrosian, senior director of product marketing for Broadcom's Wireless Connectivity Portfolio Group, said: "The introduction of Broadcom's new WICED Smart Ready chip takes its performance to new heights and cements Broadcom's industry leadership in the Internet of Things (IoT). "In addition to doubling device data rates, we eliminate the need for an external microcontroller (MCU), saving costs and reducing time to market for Oems and developers building next-generation applications."

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