Technology Articles

2015-07 Passive Components Vishay

[Jul 5 2015] Vishay Intertechnology, Inc. (NYSE: VSH announced the continued expansion of its vPolyTan™ T55 family of surface-mount polymer tantalum capacitors with the introduction of A, B, and T(with a maximum height of 1.2mm for low-height B shapes) in eight new performance specifications. The Vishay Polytech T55 series leverages Vishay's leading packaging technology and recent investments in tantalum poly ...

2015-07 Power ZF Electronics

[Jul 4 2015] X-FAB's chip foundry AG - Analog/mixed Signal and Micro-electro-mechanical Systems (MEMS) foundry - has announced what it claims is the first cost-effective 180-nanometer silicon insulator (SOI) technology for automotive and industrial applications that need to operate in harsh environments. X-FAB says its new kit 40V and 60V high-voltage devices for its XT018 180-nm SOI platform outperform batch ...

2015-07 Semiconductors Samsung

[Jul 3 2015] Samsung Electronics announced the launch of the 2 terabyte (TB) 850 PRO and 850 EVO solid-state drive (SSD). Based on the retail SSD lineup, Samsung's 3D Vertical NAND (V-NAND) now features 20 different products with a wide range of 120 gigabytes (GB) to 2TB capacity options. Available in 50 countries, the launch of 2TB drives addresses the growing consumer demand for high-performance and high-ca ...

2015-07 Semiconductors Toshiba Semiconductor and Storage

[Jul 2 2015] Toshiba Corporation announced that it has developed an embedded processing based on 65nm logic process flash memory using less power than the current mainstream technology and a single-layer polysilicon non-volatile memory (NVM) process based on a 130nm logic and analog power supply process. Different applications in the application optimization process will allow Toshiba to expand its product li ...

2015-07 Connectors Xilinx

[Jul 1 2015] Xilinx announced the start of production of the industry's first All-programmable multiprocessor SoC (MPSoC) using TSMC's 16nm FF+ process. It is also developed for embedded vision systems such as ADAS, driverless cars, Industrial Internet of Things (I-IoT) and 5G wireless systems. The All Programmable Zynq® UltraScale+™MPSoC offers five times more system-level performance and power, supports arb ...

2015-07 Connectors Renesas Electronics America

[Jul 1 2015] Renesas Electronics has announced the RL78/G1F series of multifunction microcontrollers, adding 20 new members to the RL78 family of low-power microcontrollers. With enhanced peripherals and compatibility with all RL78/G1x series microcontrollers, the new product further simplifies senorless brushless direct current motor (BLDC motor) control, providing high speed and high precision precision mot ...

2015-06 Connectors STMicroelectronics

[Jun 30 2015] STMicroelectronics' new software-based innovation dramatically simplifies the time and steps needed to add voice-activated technology to wearable devices. The wearables market has taken off with the arrival of products with more sophisticated designs, such as smartwatches. Market research firm IHS predicts that by 2019, wearable product sales will reach 135 million units, product designs will bec ...

2015-06 Passive Components Vishay

[Jun 29 2015] Vishay introduces the WSLP0805 in a compact 0805 package size with power levels up to 1W. 18-- Surface mount Power Metal Strip® resistor. Vishay Dale WSLP0805... With a high power to space ratio and an extremely low resistance of 0.005Ω, the 18 offers significant space savings in automotive and computer applications. WSLP0805... 18 resistance structure advanced, using low TCR(< 20PPM/℃) solid Met ...

2015-06 Passive Components TDK

[Jun 28 2015] TDK Group has recently launched EPCOS 'new High surge Current flow capability - multilayer varistor series. The series has A high surge current capability that can withstand A single surge current of up to 5000 A in 8/20µs pulses and up to 10 surges of up to 3500 A, with operating voltages up to 65 V DC. In addition, the new SMD element is extremely compact, with package sizes of EIA1210 to EIA22 ...

2015-06 Connectors Diodes Incorporated

[Jun 27 2015] Diodes Corporation introduces the complementary dual MOSFETs combination DMC1028UFDB designed to increase the power density of DC-DC converters. The new product integrates N-channel MOSFETs and P-channel MOSFETs into a single DFN2020 package. The device is designed for point-of-load converters, providing core voltages from 3.3V down to 1V for ASics. Target applications include Ethernet network co ...

2015-06 Sensors Vishay

[Jun 26 2015] Vishay Intertechnology has announced the release of the new AEC-Q200 certified PTS Series Platinum SMD flat sheet temperature sensor, the PTS AT. The Vishay Beyschlag PTS AT series devices improve thermal cycling performance at higher temperatures of +175 ° C, providing accurate and stable temperature detection capabilities for automotive, industrial and aerospace electronics. Using a tightly con ...

2015-06 Power Power Integrations

[Jun 25 2015] Power Integrations announced the introduction of the HiperPFSTM-3 series of power factor correction ics, new devices that deliver high power factor and high efficiency across the entire load range. The IC series is ideal for applications requiring continuous output power of up to 405 W with general purpose inputs and peak power of up to 900 W with high voltage inputs, with over 95% efficiency fro ...