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Embedded Processors & Controllers

Records 108,692
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XCZU15EG-2FFVC900E

SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock8,478
XCZU15EG-2FFVC900I

SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock7,074
XCZU15EG-3FFVB1156E

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 667MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock2,736
XCZU15EG-3FFVC900E

SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 667MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock3,562
XCZU15EG-L1FFVB1156I

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock478
XCZU15EG-L1FFVC900I

SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock6,498
XCZU15EG-L2FFVB1156E

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock5,256
XCZU15EG-L2FFVC900E

SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock4,212
XCZU17EG-1FFVB1517E

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock7,146
XCZU17EG-1FFVB1517I

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock2,628
XCZU17EG-1FFVC1760E

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock2,628
XCZU17EG-1FFVC1760I

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock2,412
XCZU17EG-1FFVD1760E

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock6,876
XCZU17EG-1FFVD1760I

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock4,464
XCZU17EG-1FFVE1924E

SoC (System On Chip)

IC SOC CORTEX-A53 1924FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
In Stock4,518
XCZU17EG-1FFVE1924I

SoC (System On Chip)

IC SOC CORTEX-A53 1924FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
In Stock6,012
XCZU17EG-2FFVB1517E

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock3,762
XCZU17EG-2FFVB1517I

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock6,912
XCZU17EG-2FFVC1760E

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock7,115
XCZU17EG-2FFVC1760I

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock8,370
XCZU17EG-2FFVD1760E

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock6,354
XCZU17EG-2FFVD1760I

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock3,906
XCZU17EG-2FFVE1924E

SoC (System On Chip)

IC SOC CORTEX-A53 1924FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
In Stock3,490
XCZU17EG-2FFVE1924I

SoC (System On Chip)

IC SOC CORTEX-A53 1924FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
In Stock5,742
XCZU17EG-3FFVB1517E

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 667MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock8,802
XCZU17EG-3FFVC1760E

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 667MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock8,766
XCZU17EG-3FFVD1760E

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 667MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock4,086
XCZU17EG-3FFVE1924E

SoC (System On Chip)

IC SOC CORTEX-A53 1924FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 667MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
In Stock4,068
XCZU17EG-L1FFVB1517I

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock3,672
XCZU17EG-L1FFVC1760I

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock3,418