Embedded Processors & Controllers

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Records 108,692

Page 3611/3624

Part Number	Description	In Stock
XC7Z045-2FBG676CES Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock4,356
XC7Z045-2FBG676E Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock4,968
XC7Z045-2FBG676I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock600
XC7Z045-2FF676I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock2,484
XC7Z045-2FF900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock4,590
XC7Z045-2FF900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock5,778
XC7Z045-2FFG676E Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock35
XC7Z045-2FFG676I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock644
XC7Z045-2FFG900CES Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock4,140
XC7Z045-2FFG900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock556
XC7Z045-2FFG900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock146
XC7Z045-3FBG676E Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 1GHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1GHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock2,394
XC7Z045-3FFG676E Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 1GHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1GHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock6,552
XC7Z045-3FFG900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 1GHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1GHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock1,183
XC7Z045-3FFV676E Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 1GHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1GHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock2,862
XC7Z045-L2FBG676I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock3,528
XC7Z045-L2FFG676I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock3,564
XC7Z045-L2FFG900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock59
XC7Z100-1FF900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock3,888
XC7Z100-1FFG1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 1156BGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock5,040
XC7Z100-1FFG900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock4,490
XC7Z100-2FF900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock5,418
XC7Z100-2FFG1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 1156BGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock296
XC7Z100-2FFG900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock1,025
XC7Z100-L2FFG1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 1156BGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock7,560
XC7Z100-L2FFG900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock3,168
XCZU11EG-1FFVB1517E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	In Stock8,388
XCZU11EG-1FFVB1517I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	In Stock2,268
XCZU11EG-1FFVC1156E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock5,076
XCZU11EG-1FFVC1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock7,380

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