Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

XCZU17EG-1FFVC1760E

XCZU17EG-1FFVC1760E

For Reference Only

Part Number XCZU17EG-1FFVC1760E
PNEDA Part # XCZU17EG-1FFVC1760E
Description IC SOC CORTEX-A53 1760FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 2,628
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Nov 27 - Dec 2 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XCZU17EG-1FFVC1760E Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXCZU17EG-1FFVC1760E
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XCZU17EG-1FFVC1760E, XCZU17EG-1FFVC1760E Datasheet (Total Pages: 102, Size: 2,181.63 KB)
PDFXCZU19EG-3FFVD1760E Datasheet Cover
XCZU19EG-3FFVD1760E Datasheet Page 2 XCZU19EG-3FFVD1760E Datasheet Page 3 XCZU19EG-3FFVD1760E Datasheet Page 4 XCZU19EG-3FFVD1760E Datasheet Page 5 XCZU19EG-3FFVD1760E Datasheet Page 6 XCZU19EG-3FFVD1760E Datasheet Page 7 XCZU19EG-3FFVD1760E Datasheet Page 8 XCZU19EG-3FFVD1760E Datasheet Page 9 XCZU19EG-3FFVD1760E Datasheet Page 10 XCZU19EG-3FFVD1760E Datasheet Page 11

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • XCZU17EG-1FFVC1760E Datasheet
  • where to find XCZU17EG-1FFVC1760E
  • Xilinx

  • Xilinx XCZU17EG-1FFVC1760E
  • XCZU17EG-1FFVC1760E PDF Datasheet
  • XCZU17EG-1FFVC1760E Stock

  • XCZU17EG-1FFVC1760E Pinout
  • Datasheet XCZU17EG-1FFVC1760E
  • XCZU17EG-1FFVC1760E Supplier

  • Xilinx Distributor
  • XCZU17EG-1FFVC1760E Price
  • XCZU17EG-1FFVC1760E Distributor

XCZU17EG-1FFVC1760E Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC EG
ArchitectureMCU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed500MHz, 600MHz, 1.2GHz
Primary AttributesZynq®UltraScale+™ FPGA, 926K+ Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case1760-BBGA, FCBGA
Supplier Device Package1760-FCBGA (42.5x42.5)

The Products You May Be Interested In

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

600MHz, 667MHz, 1.5GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

784-BFBGA, FCBGA

Supplier Device Package

784-FCBGA (23x23)

Manufacturer

Intel

Series

Arria 10 SX

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

1.5GHz

Primary Attributes

FPGA - 570K Logic Elements

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1517-BBGA, FCBGA

Supplier Device Package

1517-FBGA, FC (40x40)

Manufacturer

Intel

Series

Arria 10 SX

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

1.5GHz

Primary Attributes

FPGA - 320K Logic Elements

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1152-BBGA, FCBGA

Supplier Device Package

1152-FBGA, FC (35x35)

Manufacturer

Intel

Series

Arria 10 SX

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

1.5GHz

Primary Attributes

FPGA - 660K Logic Elements

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1517-BBGA, FCBGA

Supplier Device Package

1517-FBGA, FC (40x40)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC CG

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

Recently Sold

FHAC0001ZXJ

FHAC0001ZXJ

Littelfuse

FUSE HLDR BLADE 32V 20A IN LINE

KSZ8863MLLI

KSZ8863MLLI

Microchip Technology

IC ETHERNET SWITCH 3PORT 48-LQFP

PBRC4.00HR50X000

PBRC4.00HR50X000

Kyocera

CER RES 4.0000MHZ 30PF SMD

USB4604-1080HN

USB4604-1080HN

Microchip Technology

IC USB HUB/FLASH CTLR 48QFN

DEA202450BT-1294C1-H

DEA202450BT-1294C1-H

TDK

FILTER BANDPASS WLAN&BLUETOOTH

EP4CE40F23I7N

EP4CE40F23I7N

Intel

IC FPGA 328 I/O 484FBGA

SMAJ36CA

SMAJ36CA

Littelfuse

TVS DIODE 36V 58.1V DO214AC

74ACT08SC

74ACT08SC

ON Semiconductor

IC GATE AND 4CH 2-INP 14SOIC

1SMB36AT3G

1SMB36AT3G

Littelfuse

TVS DIODE 36V 58.1V SMB

TAJB107M006RNJ

TAJB107M006RNJ

CAP TANT 100UF 20% 6.3V 1411

BLM31PG391SN1L

BLM31PG391SN1L

Murata

FERRITE BEAD 390 OHM 1206 1LN

MMSZ4699T1G

MMSZ4699T1G

ON Semiconductor

DIODE ZENER 12V 500MW SOD123