Embedded Processors & Controllers

CPLDs (Complex Programmable Logic Devices) (4,299)
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FPGAs (Field Programmable Gate Array) with Microcontrollers (69)
Microcontroller, Microprocessor, FPGA Modules (903)
Microcontrollers (69,011)
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Records 108,692

Page 3616/3624

Part Number	Description	In Stock
XCZU2EG-2SFVA625E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock4,698
XCZU2EG-2SFVA625I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock4,734
XCZU2EG-2SFVC784E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock3,600
XCZU2EG-2SFVC784I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock2,377
XCZU2EG-3SBVA484E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	In Stock8,460
XCZU2EG-3SFVA625E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock5,634
XCZU2EG-3SFVC784E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock3,456
XCZU2EG-L1SBVA484I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	In Stock6,300
XCZU2EG-L1SFVA625I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock8,838
XCZU2EG-L1SFVC784I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock5,148
XCZU2EG-L2SBVA484E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	In Stock7,758
XCZU2EG-L2SFVA625E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock7,380
XCZU2EG-L2SFVC784E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock8,676
XCZU3CG-1SBVA484E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	In Stock4,698
XCZU3CG-1SBVA484I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	In Stock4,176
XCZU3CG-1SFVA625E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock4,230
XCZU3CG-1SFVA625I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock2,232
XCZU3CG-1SFVC784E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock7,128
XCZU3CG-1SFVC784I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock8,262
XCZU3CG-2SBVA484E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	In Stock2,502
XCZU3CG-2SBVA484I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	In Stock4,932
XCZU3CG-2SFVA625E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock8,298
XCZU3CG-2SFVA625I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock2,988
XCZU3CG-2SFVC784E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock7,938
XCZU3CG-2SFVC784I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock7,722
XCZU3CG-L1SBVA484I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	In Stock6,066
XCZU3CG-L1SFVA625I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock2,160
XCZU3CG-L1SFVC784I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock3,580
XCZU3CG-L2SBVA484E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	In Stock6,246
XCZU3CG-L2SFVA625E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock8,946

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