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XCZU15EG-2FFVC900I

XCZU15EG-2FFVC900I

For Reference Only

Part Number XCZU15EG-2FFVC900I
PNEDA Part # XCZU15EG-2FFVC900I
Description IC SOC CORTEX-A53 900FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 7,074
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Nov 27 - Dec 2 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XCZU15EG-2FFVC900I Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXCZU15EG-2FFVC900I
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XCZU15EG-2FFVC900I, XCZU15EG-2FFVC900I Datasheet (Total Pages: 102, Size: 2,181.63 KB)
PDFXCZU19EG-3FFVD1760E Datasheet Cover
XCZU19EG-3FFVD1760E Datasheet Page 2 XCZU19EG-3FFVD1760E Datasheet Page 3 XCZU19EG-3FFVD1760E Datasheet Page 4 XCZU19EG-3FFVD1760E Datasheet Page 5 XCZU19EG-3FFVD1760E Datasheet Page 6 XCZU19EG-3FFVD1760E Datasheet Page 7 XCZU19EG-3FFVD1760E Datasheet Page 8 XCZU19EG-3FFVD1760E Datasheet Page 9 XCZU19EG-3FFVD1760E Datasheet Page 10 XCZU19EG-3FFVD1760E Datasheet Page 11

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XCZU15EG-2FFVC900I Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC EG
ArchitectureMCU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed533MHz, 600MHz, 1.3GHz
Primary AttributesZynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31x31)

The Products You May Be Interested In

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 600MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

625-BFBGA, FCBGA

Supplier Device Package

625-FCBGA (21x21)

Manufacturer

Intel

Series

Cyclone® V SE

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

64KB

Peripherals

DMA, POR, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

600MHz

Primary Attributes

FPGA - 85K Logic Elements

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

484-FBGA

Supplier Device Package

484-UBGA (19x19)

Manufacturer

Intel

Series

Cyclone® V SE

Architecture

MCU, FPGA

Core Processor

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

64KB

Peripherals

DMA, POR, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

600MHz

Primary Attributes

FPGA - 25K Logic Elements

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

672-FBGA

Supplier Device Package

672-UBGA (23x23)

A2F200M3F-FG484I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

256KB

RAM Size

64KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, SPI, UART/USART

Speed

80MHz

Primary Attributes

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

484-BGA

Supplier Device Package

484-FPBGA (23x23)

Manufacturer

Xilinx Inc.

Series

Zynq®-7000

Architecture

MCU, FPGA

Core Processor

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Flash Size

-

RAM Size

256KB

Peripherals

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Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

1GHz

Primary Attributes

Kintex™-7 FPGA, 350K Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

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