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Embedded Processors & Controllers

Records 108,692
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XCZU11EG-1FFVC1760E

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock627
XCZU11EG-1FFVC1760I

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock6,192
XCZU11EG-1FFVF1517E

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock7,506
XCZU11EG-1FFVF1517I

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock7,398
XCZU11EG-2FFVB1517E

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock2,736
XCZU11EG-2FFVB1517I

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock5,490
XCZU11EG-2FFVC1156E

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock8,010
XCZU11EG-2FFVC1156I

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock4,086
XCZU11EG-2FFVC1760E

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock6,228
XCZU11EG-2FFVC1760I

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock421
XCZU11EG-2FFVF1517E

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock2,340
XCZU11EG-2FFVF1517I

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock2,214
XCZU11EG-3FFVB1517E

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 667MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock2,160
XCZU11EG-3FFVC1156E

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 667MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock4,230
XCZU11EG-3FFVC1760E

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 667MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock8,280
XCZU11EG-3FFVF1517E

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 667MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock8,442
XCZU11EG-L1FFVB1517I

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock2,322
XCZU11EG-L1FFVC1156I

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock7,092
XCZU11EG-L1FFVC1760I

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock7,236
XCZU11EG-L1FFVF1517I

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock4,302
XCZU11EG-L2FFVB1517E

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock6,300
XCZU11EG-L2FFVC1156E

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock3,726
XCZU11EG-L2FFVC1760E

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
In Stock2,700
XCZU11EG-L2FFVF1517E

SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock2,844
XCZU15EG-1FFVB1156E

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock279
XCZU15EG-1FFVB1156I

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock225
XCZU15EG-1FFVC900E

SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock2,232
XCZU15EG-1FFVC900I

SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock5,994
XCZU15EG-2FFVB1156E

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock4,500
XCZU15EG-2FFVB1156I

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock16