Technology Articles
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STMicroelectronics chip aimed at AMOLED display device applications
2012-03
Power
STMicroelectronics
[Mar 9 2012] STMicroelectronics uses advanced technology to develop the latest micro power chip. STOD13AS uses ST's innovative Silicon on Insulator (SOI) process technology for better energy efficiency and longer battery life. Excellent resistance to mobile phone noise ensures that the display is flicker-free, making it ideal for smartphones or portable electronics equipped with AMOLED displays. AMOLED displa ...
Qualcomm announces 5th generation embedded Gobi data platform with LTE multi-band support
2012-03
Power
Qualcomm
[Mar 8 2012] Qualcomm has introduced the fifth generation of its embedded Gobi reference data connectivity platform, which can be used on mobile devices including ultra-thin laptops, tablets and dual-purpose tablets. Based on Qualcomm Gobi 4G LTE wireless baseband modem MDM9615 And MDM9215 This technology can provide fast LTE connectivity on global FDD and TDD networks, while being backward compatible with HS ...
NXP and FeliCa Networks launch NFC RF controllers
2012-03
Connectors
NXP
[Mar 7 2012] NXP Semiconductors and FeliCa Networks announced that they will work closely to ensure that NXP's NFC family of RF controller solutions are interoperable with Japan's FeliCa™ (NFC-F) standard infrastructure. With NXP's single-chip NFC RF controller, device manufacturers will be able to design and produce handsets that are truly interoperable with global infrastructure. NXP and FeliCa Networks pla ...
Renesas Communications Technologies introduces an integrated LTE three-mode platform
2012-03
Power
Renesas Electronics America
[Mar 6 2012] Renesas Electronics and its subsidiary Renesas Mobile Corporation, a provider of advanced wireless modem solutions and platforms, Renesas Communications Technologies announced the MP5232, the first single-chip, high-performance, scalable smartphone platform for the $150- $300 product market. The MP5232 platform is designed to help Oems accelerate the production of LTE/HSPA+ enabled smartphones, t ...
Renesas Electronics introduces low-power P-channel MOSFETs
2012-03
Power
Renesas Electronics America
[Mar 5 2012] Renesas Electronics Corporation announced the launch of a family of five low-power P-channel power metal oxide semiconductor field-effect transistors (MOSFETs). Includes µPA2812T1L optimized for uses such as charge control switches for lithium-ion (Li-ion) secondary batteries in notebook computers and power management switches for power conversion with AC adapters. In recent years, the demand for ...
Microchip introduces universal 8-bit microcontroller
2012-03
Connectors
Microchip Technology
[Mar 4 2012] Microchip Technology announced at the Embedded World Conference in Germany that its new 8-bit single-chip microcomputer (MCU) family featuring a new generation of analog and digital peripherals is ideal for general-purpose applications, as well as battery charging, LED lighting, ballast control, power conversion and system control applications. The PIC12F(HV)752 MCU integrates complementary outpu ...
IDT introduces the latest series of low-jitter SiGe VCSO products for fiber optic telecommunications applications
2012-03
Semiconductors
IDT, Integrated Device Technology
[Mar 3 2012] IDT Corporation announced that it has introduced a new family of low-jitter silicon germanium (SiGe) surface acoustic (SAW) voltage-controlled oscillators (VCSO). Complementary to IDT's popular M675 series and high performance timing portfolio, the new product family is designed with higher frequency low jitter oscillators to meet the stringent requirements of fiber optic telecommunications appli ...
Renesas Communications Technologies introduces the first integrated LTE three-mode platform for full-featured smartphones
2012-03
Power
Renesas Electronics America
[Mar 2 2012] Renesas Electronics and its subsidiary Renesas Mobile Corporation, a provider of advanced wireless modem solutions and platforms, Renesas Communications Technologies announced the MP5232, the first single-chip, high-performance, scalable smartphone platform for the $150- $300 product market. The MP5232 platform is designed to help Oems accelerate the production of LTE/HSPA+ enabled smartphones, t ...
Intel announced that it will contract 22nm FPgas for Tabula
2012-03
Power
Intel
[Mar 1 2012] There is never enough capacity for AMD, and there often seems to be excess at Intel. At the end of 2010, Intel announced that it would use the new 22nm process to manufacture FPGA chips for Archronix Semiconductor, and subsequently set up a dedicated Foundry "Intel Custom Foundry". Now, Intel has won a second contract customer, or to manufacture 22nm FPGas for people. Tabula Inc., a provider of p ...
Infineon introduces the XMC4000, a family of 32-bit MCU products for industrial applications
2012-02
Connectors
Infineon Technologies
[Feb 29 2012] Infineon Technologies has introduced a new family of XMC4000 32-bit microcontrollers using ARM® Cortex™-M4 processors. Infineon has used more than 30 years of experience in developing application-optimized peripherals with excellent real-time capabilities to design the XMC4000 product family, which combines the benefits of a widely adopted kernel architecture. The XMC4000 product family addresses ...
Microchip introduces a new family of 16-bit PIC24 Lite microcontrollers
2012-02
Connectors
Microchip Technology
[Feb 28 2012] Microchip Technology announced the launch of a new family of 16-bit PIC24 Lite microcontroller (MCU) that combines ultra-low power (XLP) technology, low price, and low pin count packages, making it ideal for the most cost-sensitive applications in consumer, medical, and security. The PIC24F "KL" series has a typical hibernation current of 30 nA at 25 ° C and a typical operating current of 150 μA/ ...
NXP introduces dual power supply voltage ARM Cortex-M0 microcontroller
2012-02
Connectors
NXP
[Feb 27 2012] NXP Semiconductors announced the introduction of the LPC1100LV series, the world's first ARM® Cortex™-M0 microcontroller that supports dual supply voltages from 1.65V to 1.95V VDD and 1.65V to 3.6V VIO. The LPC1100LV series is available in a 2mm x 2mm micro package with performance up to 50 MIPS and power consumption more than three times lower than comparable 3.3V VDD devices. The LPC1100LV plat ...