Technology Articles

2012-02 Semiconductors TE Connectivity

[Feb 26 2012] TE Circuit Protection, a business unit of TE Connectivity, today announced the availability of reflow Solderable thermal protection (RTP) devices for rated AC (AC) and rated DC (DC) with a 140°C disconnect temperature (TOPEN). The innovative RTP devices enable quick and easy installation using industry-standard component mount and lead-free reflow equipment, ensuring manufacturers achieve signifi ...

2012-02 Semiconductors Broadcom

[Feb 25 2012] Broadcom announced the launch of the world's first 5G WiFi system-on-a-chip (SoC), the BCM43460, further strengthening its leadership and strong momentum in the 5G WiFi chip market. The BCM43460 is designed to meet the growing need for gigabit interconnection in enterprise networks, wireless cloud networks and carrier access networks. The BCM43460 System on a Chip (SoC) is based on the new IEEE 8 ...

2012-02 Semiconductors STMicroelectronics

[Feb 24 2012] STMicroelectronics expands the SLLIMM(Low Loss Intelligent Micro Die Block) product line with the introduction of two new micro motor drive modules that improve the energy efficiency level of home appliances. ENERGY efficiency marks and energy efficiency rating marks, such as the ENERGY STAR mark and the energy efficiency rating mark for electrical goods, are mandatory industry standards in some ...

2012-02 Semiconductors Lattice Semiconductor Corporation

[Feb 23 2012] Lattice Semiconductor announced that it has shipped more than 20 million programmable mixed-signal devices. The adoption of major mixed-signal device families is growing globally, including Lattice Power Manager II, the newly released Platform Manager™, and the ispClock™ family. Lattice programmable mixed-signal devices can be used in a variety of applications, from low-cost solid-state drives to ...

2012-02 Connectors TE Connectivity

[Feb 22 2012] TE Circuit Protection, a business unit of TE Connectivity, today announced a new family of eight single/multichannel silicon electrostatic discharge (SESD) protection devices that deliver the lowest capacitance on the market (bi-directional: typical value 0.10pF, unidirectional: Typical value is 0.20pF), highest ESD protection (20kV air discharge and contact discharge) and smallest package size ( ...

2012-02 Optoelectronics STMicroelectronics

[Feb 21 2012] STMicroelectronics will enable compact digital cameras and smartphones to meet user requirements for increased built-in flash output power while supporting more advanced user control features. The new chip STCF04 is a built-in flash/flashlight dual-mode camera flash controller that can increase the maximum power of the LED flash module from today's general power design of a few watts to more than ...

2012-02 Connectors Broadcom

[Feb 20 2012] Broadcom announced the launch of the world's first single-chip microwave outdoor unit (ODU). The BCM85810 achieves an unmatched level of integration that combines the capabilities of up to 10 off-the-shelf chips, dramatically reducing the size of the microwave radio frequency unit (RFU) and reducing the unit's complexity, production costs and power consumption. In the microwave split mounted outd ...

2012-02 Connectors Renesas Electronics America

[Feb 19 2012] Renesas Electronics announced the launch of three silicon carbide (SiC) composite power devices: RJQ6020DPM, RJQ6021DPM and RJQ6022DPM. The three products combine multiple silicon carbide diodes and multiple power transistors in a single package to form power conversion circuits. These power devices are Renesas Electronics' second family of power semiconductors using silicon carbide. Silicon carb ...

2012-02 Semiconductors STMicroelectronics

[Feb 18 2012] STMicroelectronics uses advanced technology to develop the latest micro power chip. In the future, almost every smartphone or portable electronic product equipped with AMOLED display will use this advanced power chip. ST has more than 80% share of the global AMOLED power chip market. AMOLED displays have ultra-thin panels with better picture quality and viewing angles than existing LCD displays, ...

2012-02 Semiconductors NXP

[Feb 17 2012] NXP Semiconductors announces the GreenChip™ SPR TEA1716 Switched Mode Power Supply (SMPS) Controller IC - the industry's first PFC and LLC resonant combination controller for ultra-low standby power consumption at low loads. It also meets the requirements of the EU Ecodesign Directive, which will come into force in 2013. The company also announced the launch of a number of cost-effective SPF (fly ...

2012-02 Semiconductors STMicroelectronics

[Feb 16 2012] STMicroelectronics has introduced a new chip that monitors battery levels in handheld devices. Featuring the smallest package on the market, the new STC3105 combines high measurement accuracy and low power consumption to make the battery last longer and is suitable for compact portable electronic products such as mobile phones, multimedia players and digital cameras. STMicroelectronics' latest ba ...

2012-02 Connectors Renesas Electronics America

[Feb 15 2012] Renesas Electronics has announced the development of the Schottky Barrier Diode (SBD) RJS6005TDPP, which uses silicon carbide material - a material considered to have great potential for use in power semiconductor devices. The new SiC Schottky barrier diode is suitable for high-power electronic systems such as air conditioners, communication base stations and solar arrays. The device also uses te ...