Technology Articles

2015-08 Connectors Broadcom

[Aug 10 2015] Broadcom announced a new line of 10G/25G/40G/50G scalable Ethernet controllers. The BCM57300 NetXtreme® C Series provides the industry's lowest power consumption and smallest package 25/50G solution for the cloud data center market. With the launch of this family of products, Broadcom further strengthens its end-to-end product portfolio and reaffirms its ongoing commitment to meeting the current ...

2015-08 Semiconductors ON Semiconductor

[Aug 9 2015] ON Semiconductor introduces a new family of image coprocessors that enable high dynamic range (HDR)1080p automotive camera systems. The new AP020x family of coprocessors is designed to combine the company's high-performance 2 megapixel and 1.2 megapixel image sensors to provide a fully integrated automotive rear-view and panoramic reverse camera solution. Sandor Barna, vice president of ON Semico ...

2015-08 Connectors Molex

[Aug 8 2015] Molex introduces the ML-XT Sealed Connection system, a highly reliable safety sealing solution that minimizes electrical failures in harsh commercial vehicle applications while saving assembly costs for original equipment manufacturers and harness manufacturers. The ML-XT system complies with IP68 protection and withstands J2030 power flushing. It features a one-piece plug housing and seal design ...

2015-08 Sensors OmniVision Technologies Inc

[Aug 7 2015] OmniVision Technologies announced the introduction of the OV13853, a high-performance 13-megapixel PureCel image sensor that delivers Digital Single Lens Reflex (DSLR) quality images and functionality to mainstream mobile devices. Leveraging OmniVision's proven 1.12 micron pixel technology, the OV13853 delivers best-in-class, high-quality low-light performance while supporting advanced features s ...

2015-08 Power Intel

[Aug 6 2015] Intel Corp. and Micron Technology Inc. have introduced 3D XPOINT technology, a non-volatile memory that has the potential to revolutionize any device, application or service that benefits from fast access to large data sets. Now, in production, 3D technology XPOINT is a major breakthrough in memory process technology and the first new storage category since the introduction of NAND flash in 1989. ...

2015-08 Sensors Samsung

[Aug 5 2015] Samsung Electronics Co., LTD., a world leader in advanced semiconductor technology, announced the launch of the industry's first 1.0-micron pixel-based 160-megapixel (MP) CMOS image sensor for use in advanced mobile devices. "Starting with the 16 megapixel sensor, Samsung Electronics plans to further expand the product category of 1.0 micron pixels, and lead the image sensor market to ultra-thin ...

2015-08 Connectors Linear Technology/Analog Devices

[Aug 4 2015] Linear introduces the LT8602, a 42V input, high-efficiency, four-output synchronous single-chip step-down switching regulator. The device's 4-channel design integrates two high voltage 2.5A and 1.5A channels and two lower voltage 1.8A channels to provide four independent outputs, which can deliver voltages as low as 0.8V. Its synchronous rectification topology provides up to 93% efficiency, while ...

2015-08 Connectors Analog Devices

[Aug 3 2015] Analog Devices, Inc. introduced two analog front-end (AFE) devices with integrated 24-bit sigm-δ converter cores that offer the industry's best low-power, low-noise, and signal-chain integration performance. The AD7124-4 and AD7124-8 AFE connect directly to all standard industrial signal sources and sensor inputs while requiring 40% less power than comparable devices. Its best-in-class power perf ...

2015-08 Semiconductors Microsemi

[Aug 2 2015] Microsemi Corporation announced the availability of new automotive-grade field-programmable gate array (FPGA) and system-on-chip (SoC) FPGA devices. The next generation of flash-based, low-power FPGas and ARM® Cortex-M3 enabling SoC FPGA devices have received AEC-Q100 Level 2 certification, an industry standard specification that Outlines standards for electronic components to ensure that the fin ...

2015-08 Sensors ams

[Aug 1 2015] Ams announced the selection of the ams AS-MLV-P2MEMS Volatile Organic Compounds gas sensor for its new Eve Smart Home monitoring product Elgato. Measuring 9.1mm x 9.1mm x 4.5mm, AS-MLV-P2 is a low-power gas sensor that accurately measures the concentration of volatile organic compounds in the surrounding air. The device can accurately take different adjustment measures according to the level of c ...

2015-07 Connectors TDK

[Jul 31 2015] TDK Group introduces a new EPCOS NTC sensor element designed for measuring high temperatures up to 650 °C. The element is based on a high temperature ceramic sensor element, connected to a metallized alumina rod and then enclosed in glass, with high measurement accuracy and a temperature tolerance of only ±1 K at 200 °C. Thanks to the glass package, the new component is extremely robust. The new ...

2015-07 Connectors STMicroelectronics

[Jul 30 2015] STMicroelectronics introduces the new M-Series 650V IGBT to provide power designers with a faster and more economical energy efficiency solution. Suitable for HVAC motor drives, uninterruptible power supplies, solar converters, and all hard-switching circuit topologies for 20kHz power conversion applications. Using ST's third generation trench-gate field-stop low loss manufacturing process, the M ...