Technology Articles

2015-09 Connectors Diodes Incorporated

[Sep 3 2015] Diodes introduces the AL1678 series of LED drivers suitable for driving non-dimming LED modified bulbs in general lighting products that do not require a power factor higher than 0.7. These 500V buck converter LED drivers deliver up to 15W of output power across all bus voltages for A variety of LED lighting applications such as A/B/P lamps and GU10 lamps, reducing total circuit material costs wh ...

2015-09 Connectors Renesas Electronics America

[Sep 2 2015] Intersil announced the introduction of the ISL94203 3-8 battery pack detector to support lithium-ion or other chemical batteries used in medical mobile service vehicles, wheelchairs, electric bicycles, hand-held power tools, vacuum cleaners and solar or renewable energy storage systems. The device accurately detects, protects, and balances rechargeable battery packs to maximize battery life and e ...

2015-09 Connectors Molex

[Sep 1 2015] Molex has developed the MXP120 sealed connector system for powertrain, body electronics and safety electronics applications. Connectors and sockets for safety applications come in a distinctive yellow casing, while non-safety-related powertrain and body electronics applications come in a black casing. The 1.20 mm MXP120 sealed connector system with 4.00 mm pitch provides excellent plug, plug and ...

2015-08 Semiconductors Cypress Semiconductor

[Aug 31 2015] Cypress Semiconductor Corporation has announced a new line of energy-harvesting power management integrated circuits (PMIC) for tiny, solar-powered wireless sensors in the Internet of Things (IoT). With the lowest power consumption in the world, the new device is a single-chip energy harvesting PMIC that can use solar panels with an area of only 1 cm2. The new PMIC devices are ideal for battery-f ...

2015-08 Power Qorvo US Inc.

[Aug 30 2015] Qorvo, a leading provider of RF solutions for mobile, infrastructure, and aerospace and defense applications, announced the introduction of a hybrid line of gallium nitride (GaN)/ Gallium arsenide (GaAs) power amplifiers to expand range and meet the exploding data throughput requirements of the point-to-point radio link market. Gorden Gook, general manager of Qorvo's Transmission Business unit, s ...

2015-08 Connectors IDT, Integrated Device Technology

[Aug 29 2015] IDT has added two new members to its growing family of silicon-based RF voltage Variable attenuators (VVA) - which provide the analog control needed for precise attenuation applications - expanding the company's frequency coverage from 1MHz to 6GHz. Both devices have a bi-directional RF port, support a 3V or 5V single positive supply voltage, and have an operating temperature range of -40°C to 10 ...

2015-08 Power Qualcomm

[Aug 28 2015] Qualcomm announced that its subsidiary Qualcomm Technologies, Inc. (QTI), has introduced new versions of its Graphics Processing Unit (GPU) and Image Signal Processing (ISP) units for its next-generation vision processing technology, providing significant advancements in performance, power efficiency and user experience for SnapdragonQUALCOMM processors. The new QUALCOMM Adreno 5XX GPU architectu ...

2015-08 Passive Components KEMET

[Aug 27 2015] KEMET Corporation announced the release of its M55 module Polymer Seal (PHS) capacitor portfolio. KEMET's M550 M551 and modular series are designed for mission-critical high capacity and voltage applications and are produced by connecting T550 or T551 polymer-sealed capacitors in parallel. The series M55 is suitable for telecommunications, computer, defense and aerospace applications. With its st ...

2015-08 Semiconductors Cypress Semiconductor

[Aug 26 2015] Cypress Semiconductor and THine Electronics have announced the industry's fastest USB 3.0 camera reference design kit with a 13-megapixel resolution at 21 frames per second. The new Ascella design kit is based on Cypress's EZ-USB CX3 USB 3.0 camera controller and THine's THP7312 image signal processor (ISP). With optimized firmware, software development kits, reference circuit diagrams, and relat ...

2015-08 Power Samsung

[Aug 25 2015] Samsung Electronics announced that it has begun mass production of the industry's first 256 Gigabit (GB), 3D (3D based on 48-layer 3-bit multistage cell (MLC) arrays for use in solid-state drives (SSDS)) vertical NAND (V-NAND) flash memory. "With our launch of the third-generation V-NAND flash memory to the global market, we can now offer the best advanced memory solution based on improved perfor ...

2015-08 Semiconductors Toshiba Semiconductor and Storage

[Aug 24 2015] Toshiba announces PCIe®1 (Peripheral Component Interconnect Express) solid-state drives (SSDS for three different families using the NVMe™2 (non-volatile Memory Express) protocol for a variety of applications, including high-performance notebooks); Lightweight laptops, 2-in-1 / convertible laptops, all-in-one PCS and tablets; And server and storage applications. All three solid-state product line ...

2015-08 Connectors Texas Instruments

[Aug 23 2015] TI introduces the industry's first 20A and 30A synchronous DC/DC buck converters. This converter synchronizes noise and EMI/EMC frequency reduction, and a power management bus (PMBus) interface for Adaptive voltage scaling (AVS). TI's SWIFT 20A TPS544B25 and 30A TPS544C25 converters incorporate MOSFETs and are specifically packaged in a small PowerStack square flat leadless (QFN) package to drive ...