Infineon introduces a new generation of high-power density power modules that enable vertical power supply for AI data centers

     Infineon Technologies AG, the global semiconductor leader in power systems and the Internet of Things, has announced the launch of a new generation of high-density power modules that will play a key role in enabling AI and high-performance computing. The new OptiMOS™ TDM2454xx four-phase power module delivers industry-leading power density and reduced total cost of ownership (TCO) for AI data center operators by improving system performance and combining Infineon's consistent robustness.

     The OptiMOS™ TDM2454xx four-phase power module enables true vertical power supply (VPD) and delivers an industry-leading 2 amp/mm2 current density. This module continues Infineon's OptiMOS™ TDM2254xD and TDM2354xD biphase power modules introduced last year, which continue to deliver superior power density for accelerated computing platforms. In traditional horizontal power supply systems, the current needs to flow through the semiconductor wafer surface, which leads to increased resistance and significant power loss. Vertical power supply improves system efficiency by shortening the current transmission path and reducing resistance losses.

     According to the International Energy Agency (IEA), data centers currently account for 2 percent of global energy consumption. Driven by AI developments, power demand in data centers is expected to grow 165% between 2023 and 2030. Continuous improvements in power conversion efficiency and power density from the grid to the motherboard core are key to further improving computing performance and reducing TCO.

     Rakesh Renganathan, Vice President, Power IC Product Line, Infineon Technologies, said: "We are pleased to extend Infineon's high-performance AI data center solutions with the launch of the OptiMOS™ TDM2454xx VPD module. "Our three-dimensional design approach leverage industry-leading power devices, packaging technologies, and our deep system heritage to deliver high-performance, energy-efficient computing solutions that further our mission to drive digitization and decarbonization."

     Using Infineon's powerful OptiMOS™ 6 trench technology power assembly and embedded chip package, the OptiMOS™ TDM2454xx module delivers excellent electrical and thermal performance while continuously pushing the limits of VPD system performance and quality with innovative ultra-thin inductor design technology. In addition, the OptiMOS™ TDM2454xx's structural design facilitates modular splicing and improves current conduction for improved electrical, thermal and mechanical properties. The module supports up to 280A current in a four-phase power supply and incorporates an embedded capacitor layer in a small package of only 10x9 mm², which, combined with Infineon's XDP™ controller, enables a stable and durable high-current density power solution.

     The OptiMOS™ TDM2454xx module further strengthens Infineon's special position in the market. With a broad portfolio of products and technologies based on all relevant semiconductor materials, Infineon is able to power different AI server configurations from the grid to the core in a more energy efficient way.