Technology Articles

2012-02 Connectors TE Connectivity

[Feb 22 2012] TE Circuit Protection, a business unit of TE Connectivity, today announced a new family of eight single/multichannel silicon electrostatic discharge (SESD) protection devices that deliver the lowest capacitance on the market (bi-directional: typical value 0.10pF, unidirectional: Typical value is 0.20pF), highest ESD protection (20kV air discharge and contact discharge) and smallest package size ( ...

2012-02 Optoelectronics STMicroelectronics

[Feb 21 2012] STMicroelectronics will enable compact digital cameras and smartphones to meet user requirements for increased built-in flash output power while supporting more advanced user control features. The new chip STCF04 is a built-in flash/flashlight dual-mode camera flash controller that can increase the maximum power of the LED flash module from today's general power design of a few watts to more than ...

2012-02 Connectors Broadcom

[Feb 20 2012] Broadcom announced the launch of the world's first single-chip microwave outdoor unit (ODU). The BCM85810 achieves an unmatched level of integration that combines the capabilities of up to 10 off-the-shelf chips, dramatically reducing the size of the microwave radio frequency unit (RFU) and reducing the unit's complexity, production costs and power consumption. In the microwave split mounted outd ...

2012-02 Connectors Renesas Electronics America

[Feb 19 2012] Renesas Electronics announced the launch of three silicon carbide (SiC) composite power devices: RJQ6020DPM, RJQ6021DPM and RJQ6022DPM. The three products combine multiple silicon carbide diodes and multiple power transistors in a single package to form power conversion circuits. These power devices are Renesas Electronics' second family of power semiconductors using silicon carbide. Silicon carb ...

2012-02 Semiconductors STMicroelectronics

[Feb 18 2012] STMicroelectronics uses advanced technology to develop the latest micro power chip. In the future, almost every smartphone or portable electronic product equipped with AMOLED display will use this advanced power chip. ST has more than 80% share of the global AMOLED power chip market. AMOLED displays have ultra-thin panels with better picture quality and viewing angles than existing LCD displays, ...

2012-02 Semiconductors NXP

[Feb 17 2012] NXP Semiconductors announces the GreenChip™ SPR TEA1716 Switched Mode Power Supply (SMPS) Controller IC - the industry's first PFC and LLC resonant combination controller for ultra-low standby power consumption at low loads. It also meets the requirements of the EU Ecodesign Directive, which will come into force in 2013. The company also announced the launch of a number of cost-effective SPF (fly ...

2012-02 Semiconductors STMicroelectronics

[Feb 16 2012] STMicroelectronics has introduced a new chip that monitors battery levels in handheld devices. Featuring the smallest package on the market, the new STC3105 combines high measurement accuracy and low power consumption to make the battery last longer and is suitable for compact portable electronic products such as mobile phones, multimedia players and digital cameras. STMicroelectronics' latest ba ...

2012-02 Connectors Renesas Electronics America

[Feb 15 2012] Renesas Electronics has announced the development of the Schottky Barrier Diode (SBD) RJS6005TDPP, which uses silicon carbide material - a material considered to have great potential for use in power semiconductor devices. The new SiC Schottky barrier diode is suitable for high-power electronic systems such as air conditioners, communication base stations and solar arrays. The device also uses te ...

2012-02 Connectors Maxim Integrated

[Feb 14 2012] Maxim Integrated introduces the Teridian three-phase Power Measurement System-on-Chip (SoC) 78M6631 for power monitoring of high-power loads. A fully integrated customizable power measurement system with complete measurement and diagnostic functions simplifies design and reduces costs. The 78M6631 is suitable for a variety of applications that require monitoring of three-phase power and supply qu ...

2012-02 Semiconductors NXP

[Feb 13 2012] NXP Semiconductors has set an important new benchmark for miniaturization by announcing a new generation of low-VF Schottky rectifiers for the mobile device market. The new DFN1608D-2 (SOD1608) plastic package has A typical thickness of just 0.37 mm and dimensions of 1.6 x 0.8 mm, making it the smallest device on the market to support up to 1.5A currents. The DFN1608D-2 includes a total of six Sc ...

2012-02 Semiconductors Dialog Semiconductor GmbH

[Feb 12 2012] Dialog, a highly integrated and innovative provider of power management, audio and proximity wireless technology solutions, announced that its Green VoIP chip family of ultra-low power voip chips has been adopted by VTech, a leading provider of corded and cordless phones. Under the terms of the partnership agreement, Vtech will use Dialog's SC14452 and SC14461VoIP processors and Rhea software sui ...

2012-02 Passive Components Vishay

[Feb 11 2012] Vishay Intertechnolog has announced the launch of its new surface mount Power Metal Strip resistor, the WSLP2512, in the 2512 form factor, with a power of up to 3W and an extremely low resistance of 0.0005Ω. The advanced construction of the WSLP2512 resistor includes a low TCR(< 20PPM/ C) solid Metal nickel chromium or manganese copper resistance core, and specially selected and stabilized materi ...