Technology Articles

2012-03 Connectors STMicroelectronics

[Mar 20 2012] STMicroelectronics introduces the first 3-axis digital output gyroscope on the market that complies with the automotive integrated Circuit standard (AEC-Q100). St's latest angular speed sensors are designed to improve the accuracy and stability of automotive equipment, including in-dash navigators, telematics systems and road and bridge toll systems. STMicroelectronics' automotion-grade gyroscope ...

2012-03 Connectors Analog Devices

[Mar 19 2012] Analog Device introduces the AD5700, a complete HART (Addressable Remote Sensor High Speed Channel) modem IC that supports HART connectivity in process control applications such as smart sensors and factory automation equipment. The single-chip device is the industry's lowest-power modem IC and is fully compatible with the HART communication protocol, the global standard for sending and receiving ...

2012-03 Passive Components Vishay

[Mar 18 2012] Vishay Intertechnology, Inc. announced the introduction of its new professional and precision series of wide-joint thin-film resistors, the MCW 0406 AT, which are the first such devices to feature the 0406 small form factor. The MCW 0406 AT professional and precision resistors provide consistent performance in harsh and high-temperature applications. The Professional series devices can operate fo ...

2012-03 Power Silicon Labs

[Mar 17 2012] Silicon Laboratories announced the introduction of the Precision32 MCU family, bringing unprecedented design flexibility to the 32-bit MCU market. The new Precision32 family of products based on ARM® Cortex™-M3 processors includes 32-bit SiM3U1xx and SiM3C1xx MCU products with pin-compatible options for integrated and non-integrated USB capabilities. By providing a highly integrated and flexible ...

2012-03 Connectors STMicroelectronics

[Mar 16 2012] STMicroelectronics introduces the INCO-M1 intelligent multi-sensor module capable of detecting 9 degrees of freedom with a built-in 32-bit processor. The new product integrates complex motion sensors, magnetic motion sensors, powerful processing capabilities and dedicated software in a single micro-module to bring extraordinary real-world experiences to gaming, human-machine interfaces, robotics, ...

2012-03 Power TE Connectivity

[Mar 15 2012] TE Circuit Protection, a division of TE Connectivity, has announced a new Metal Hybrid PPTC (MHP) device that provides intelligent activation (SA). This HPP-SA device provides a resettable, cost-effective and space-saving alternative to typical protection methods for high-power lithium battery and module applications. These applications include cordless power tools, electric bicycles and light el ...

2012-03 Connectors Cypress Semiconductor

[Mar 14 2012] Cypress Semiconductor introduces the TMA140 TrueTouch controller for lower cost mobile phones. The new family offers high-performance touch screen control for screens up to 5 inches, including multi-finger control support and the industry's best signal-to-noise ratio (SNR). In addition, the new controller supports Cypress's patent-pending Charger Armor feature, which avoids false touch issues cau ...

2012-03 Power MICROSS/On Semiconductor

[Mar 13 2012] MIPS Technologies, a leader in industry-standard processor architectures and cores for digital home, networking and mobile applications, and SAI Technology, a leader in secure wireless communications for the global mobile wireless market, today announced that When running SAI's LTE stack with MIPS multithreading technology on user end devices, performance improvements of more than 65% can be achi ...

2012-03 Connectors Microchip Technology

[Mar 12 2012] Microchip Technology, the world's leading supplier of integrated microcontrollers, emulators and flash memory patented solutions, announced at Embedded World Congress in Germany that it has launched a new 8-bit single-chip microcomputer (MCU) family using a new generation of analog and digital peripherals for general purpose applications. Ideal for battery charging, LED lighting, ballast control, ...

2012-03 Power Molex

[Mar 11 2012] Molex Corporation and TE Connectivity Ltd have entered into a second source agreement. Under the agreement, TE Connectivity will have the right to manufacture, market and sell a number of Molex high-speed interconnect solutions worldwide, including the z-Quad Small Size Pluggable +(zQSFP+) and Small Size Pluggable +(zSFP+). Molex will have the right to manufacture, market and sell TE Connectivity ...

2012-03 Power Analog Devices

[Mar 10 2012] Analog Devices announced that Lantronix has selected Analog Devices' iCoupler digital isolator technology to build its new family of wireless communications network servers. The EDS-MD family of multi-port medical device servers represents the latest achievement in medical communications and features a compact, secure and lightweight plastic housing that enables remote control and system-level ma ...

2012-03 Power STMicroelectronics

[Mar 9 2012] STMicroelectronics uses advanced technology to develop the latest micro power chip. STOD13AS uses ST's innovative Silicon on Insulator (SOI) process technology for better energy efficiency and longer battery life. Excellent resistance to mobile phone noise ensures that the display is flicker-free, making it ideal for smartphones or portable electronics equipped with AMOLED displays. AMOLED displa ...