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XC7Z100-2FFG900I

XC7Z100-2FFG900I

For Reference Only

Part Number XC7Z100-2FFG900I
PNEDA Part # XC7Z100-2FFG900I
Description IC SOC CORTEX-A9 800MHZ 900FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 1,025
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Apr 21 - Apr 26 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XC7Z100-2FFG900I Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXC7Z100-2FFG900I
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)

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XC7Z100-2FFG900I Specifications

ManufacturerXilinx Inc.
SeriesZynq®-7000
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 444K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31x31)

The Products You May Be Interested In

Manufacturer

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Series

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Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

667MHz

Primary Attributes

Artix™-7 FPGA, 28K Logic Cells

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

225-LFBGA, CSPBGA

Supplier Device Package

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Manufacturer

Intel

Series

Arria V SX

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

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64KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

925MHz

Primary Attributes

FPGA - 350K Logic Elements

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

1517-BBGA, FCBGA

Supplier Device Package

1517-FBGA, FC (40x40)

Manufacturer

Intel

Series

Arria V ST

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

64KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

1.05GHz

Primary Attributes

FPGA - 350K Logic Elements

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1152-BBGA, FCBGA

Supplier Device Package

1152-FBGA, FC (35x35)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 600MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

1924-BBGA, FCBGA

Supplier Device Package

1924-FCBGA (45x45)

Manufacturer

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Series

Zynq® UltraScale+™ MPSoC CG

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

484-BFBGA, FCBGA

Supplier Device Package

484-FCBGA (19x19)

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