Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

Embedded Processors & Controllers

Records 108,692
Page 3603/3624
Image
Part Number
Description
In Stock
Quantity
M2S090TS-FG676I
M2S090TS-FG676I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 90K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
In Stock5,796
M2S090TS-FGG484
M2S090TS-FGG484

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 90K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
In Stock6,912
M2S090TS-FGG484I
M2S090TS-FGG484I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 90K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
In Stock8,532
M2S090TS-FGG676
M2S090TS-FGG676

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 90K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
In Stock4,284
M2S090TS-FGG676I
M2S090TS-FGG676I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 90K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
In Stock6,984
M2S100-1FC1152
M2S100-1FC1152

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock3,580
M2S100-1FC1152I
M2S100-1FC1152I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock3,418
M2S100-1FCG1152
M2S100-1FCG1152

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock2,916
M2S100-1FCG1152I
M2S100-1FCG1152I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock8,208
M2S100-FC1152
M2S100-FC1152

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock7,182
M2S100-FCG1152
M2S100-FCG1152

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock2,232
M2S100S-1FC1152I
M2S100S-1FC1152I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock5,148
M2S100S-1FCG1152I
M2S100S-1FCG1152I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock4,932
M2S100T-1FC1152
M2S100T-1FC1152

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock2,232
M2S100T-1FC1152I
M2S100T-1FC1152I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock3,456
M2S100T-1FCG1152
M2S100T-1FCG1152

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock7,038
M2S100T-1FCG1152I
M2S100T-1FCG1152I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock3,222
M2S100T-FC1152
M2S100T-FC1152

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock5,238
M2S100T-FCG1152
M2S100T-FCG1152

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock3,582
M2S100TS-1FC1152I
M2S100TS-1FC1152I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock2,358
M2S100TS-1FCG1152I
M2S100TS-1FCG1152I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock5,508
M2S150-1FC1152
M2S150-1FC1152

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock3,438
M2S150-1FC1152I
M2S150-1FC1152I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock6,462
M2S150-1FCG1152
M2S150-1FCG1152

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock3,060
M2S150-1FCG1152I
M2S150-1FCG1152I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock5,382
M2S150-1FCS536
M2S150-1FCS536

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 536-LFBGA, CSPBGA
  • Supplier Device Package: 536-CSPBGA (16x16)
In Stock4,176
M2S150-1FCS536I
M2S150-1FCS536I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 536-LFBGA, CSPBGA
  • Supplier Device Package: 536-CSPBGA (16x16)
In Stock2,646
M2S150-1FCSG536
M2S150-1FCSG536

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 536-LFBGA, CSPBGA
  • Supplier Device Package: 536-CSPBGA (16x16)
In Stock4,032
M2S150-1FCSG536I
M2S150-1FCSG536I

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 536-LFBGA, CSPBGA
  • Supplier Device Package: 536-CSPBGA (16x16)
In Stock5,760
M2S150-1FCV484
M2S150-1FCV484

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BFBGA
  • Supplier Device Package: 484-FBGA (19x19)
In Stock5,040