M2S150-1FCSG536I
For Reference Only
| Part Number | M2S150-1FCSG536I |
| PNEDA Part # | M2S150-1FCSG536I |
| Description | IC SOC CORTEX-M3 166MHZ 536BGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 5,760 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 20 - Mar 25 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M2S150-1FCSG536I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M2S150-1FCSG536I |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
Payment Method
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Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
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Notes
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M2S150-1FCSG536I Specifications
| Manufacturer | Microsemi Corporation |
| Series | SmartFusion®2 |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
| RAM Size | 64KB |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Speed | 166MHz |
| Primary Attributes | FPGA - 150K Logic Modules |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 536-LFBGA, CSPBGA |
| Supplier Device Package | 536-CSPBGA (16x16) |
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Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 10K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 60K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
