Embedded Processors & Controllers

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Microcontroller, Microprocessor, FPGA Modules (903)
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Records 108,692

Page 3606/3624

Part Number	Description	In Stock
M2S150TS-FCG1152I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 1152BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	In Stock3,186
M2S150TS-FCS536 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 536-LFBGA, CSPBGA Supplier Device Package: 536-CSPBGA (16x16)	In Stock5,166
M2S150TS-FCS536I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 536-LFBGA, CSPBGA Supplier Device Package: 536-CSPBGA (16x16)	In Stock5,832
M2S150TS-FCSG536 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 536-LFBGA, CSPBGA Supplier Device Package: 536-CSPBGA (16x16)	In Stock2,034
M2S150TS-FCSG536I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 536-LFBGA, CSPBGA Supplier Device Package: 536-CSPBGA (16x16)	In Stock7,128
M2S150TS-FCV484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BFBGA Supplier Device Package: 484-FBGA (19x19)	In Stock4,860
M2S150TS-FCV484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BFBGA Supplier Device Package: 484-FBGA (19x19)	In Stock4,266
M2S150TS-FCVG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BFBGA Supplier Device Package: 484-FBGA (19x19)	In Stock5,544
M2S150TS-FCVG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BFBGA Supplier Device Package: 484-FBGA (19x19)	In Stock2,100
R8A77610DA01BGV Renesas Electronics America	SoC (System On Chip) IC SOC SH-4A 400MHZ 449BGA Manufacturer: Renesas Electronics America Series: - Architecture: MPU Core Processor: SH-4A Flash Size: - RAM Size: 16KB Peripherals: DDR Connectivity: CANbus, I²C, SCI, SD, SSI, USB Speed: 400MHz Primary Attributes: - Operating Temperature: - Package / Case: 449-BGA Supplier Device Package: 449-BGA (21x21)	In Stock7,092
R8A77610DA01BGV#W9 Renesas Electronics America	SoC (System On Chip) IC SOC SH-4A 400MHZ 449BGA Manufacturer: Renesas Electronics America Series: - Architecture: MPU Core Processor: SH-4A Flash Size: - RAM Size: 16KB Peripherals: DDR Connectivity: CANbus, I²C, SCI, SD, SSI, USB Speed: 400MHz Primary Attributes: - Operating Temperature: - Package / Case: 449-BGA Supplier Device Package: 449-BGA (21x21)	In Stock8,352
R8A77610DA01BGV#YC Renesas Electronics America	SoC (System On Chip) IC SOC SH-4A 400MHZ 449BGA Manufacturer: Renesas Electronics America Series: - Architecture: MPU Core Processor: SH-4A Flash Size: - RAM Size: 16KB Peripherals: DDR Connectivity: CANbus, I²C, SCI, SD, SSI, USB Speed: 400MHz Primary Attributes: - Operating Temperature: - Package / Case: 449-BGA Supplier Device Package: 449-BGA (21x21)	In Stock2,268
R8A77610DA01BGV#YD Renesas Electronics America	SoC (System On Chip) IC SOC SH-4A 400MHZ 449BGA Manufacturer: Renesas Electronics America Series: - Architecture: MPU Core Processor: SH-4A Flash Size: - RAM Size: 16KB Peripherals: DDR Connectivity: CANbus, I²C, SCI, SD, SSI, USB Speed: 400MHz Primary Attributes: - Operating Temperature: - Package / Case: 449-BGA Supplier Device Package: 449-BGA (21x21)	In Stock3,006
R8A77610DA01BGV#YE Renesas Electronics America	SoC (System On Chip) IC SOC SH-4A 400MHZ 449BGA Manufacturer: Renesas Electronics America Series: - Architecture: MPU Core Processor: SH-4A Flash Size: - RAM Size: 16KB Peripherals: DDR Connectivity: CANbus, I²C, SCI, SD, SSI, USB Speed: 400MHz Primary Attributes: - Operating Temperature: - Package / Case: 449-BGA Supplier Device Package: 449-BGA (21x21)	In Stock5,418
R8A77610DA01BGV#YF Renesas Electronics America	SoC (System On Chip) IC SOC SH-4A 400MHZ 449BGA Manufacturer: Renesas Electronics America Series: - Architecture: MPU Core Processor: SH-4A Flash Size: - RAM Size: 16KB Peripherals: DDR Connectivity: CANbus, I²C, SCI, SD, SSI, USB Speed: 400MHz Primary Attributes: - Operating Temperature: - Package / Case: 449-BGA Supplier Device Package: 449-BGA (21x21)	In Stock6,444
XA7Z010-1CLG225Q Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 225BGA Manufacturer: Xilinx Inc. Series: Automotive, AEC-Q100, Zynq®-7000 XA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13)	In Stock8,082
XA7Z010-1CLG400I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 400BGA Manufacturer: Xilinx Inc. Series: Automotive, AEC-Q100, Zynq®-7000 XA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17)	In Stock8,748
XA7Z010-1CLG400Q Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 400BGA Manufacturer: Xilinx Inc. Series: Automotive, AEC-Q100, Zynq®-7000 XA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17)	In Stock4,032
XA7Z020-1CLG400I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 400BGA Manufacturer: Xilinx Inc. Series: Automotive, AEC-Q100, Zynq®-7000 XA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17)	In Stock4,122
XA7Z020-1CLG400Q Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 400BGA Manufacturer: Xilinx Inc. Series: Automotive, AEC-Q100, Zynq®-7000 XA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17)	In Stock203
XA7Z020-1CLG484Q Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 484BGA Manufacturer: Xilinx Inc. Series: Automotive, AEC-Q100, Zynq®-7000 XA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	In Stock209
XA7Z030-1FBG484I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 484FCBGA Manufacturer: Xilinx Inc. Series: Automotive, AEC-Q100, Zynq®-7000 XA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	In Stock8,118
XA7Z030-1FBG484Q Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 484FCBGA Manufacturer: Xilinx Inc. Series: Automotive, AEC-Q100, Zynq®-7000 XA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	In Stock3,562
XA7Z030-1FBV484Q Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 484FCBGA Manufacturer: Xilinx Inc. Series: Automotive, AEC-Q100, Zynq®-7000 XA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	In Stock3,258
XAZU2EG-1SBVA484Q Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 1.2MB Peripherals: DMA, WDT Connectivity: CANbus, I²C, SPI, UART/USART, USB Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	In Stock7,866
XAZU2EG-1SFVA625I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 1.2MB Peripherals: DMA, WDT Connectivity: CANbus, I²C, SPI, UART/USART, USB Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock4,518
XAZU2EG-1SFVA625Q Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 1.2MB Peripherals: DMA, WDT Connectivity: CANbus, I²C, SPI, UART/USART, USB Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock2,592
XAZU2EG-1SFVC784I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 1.2MB Peripherals: DMA, WDT Connectivity: CANbus, I²C, SPI, UART/USART, USB Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock8,658
XAZU2EG-1SFVC784Q Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 1.2MB Peripherals: DMA, WDT Connectivity: CANbus, I²C, SPI, UART/USART, USB Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock5,544
XAZU2EG-L1SFVA625I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 1.2MB Peripherals: DMA, WDT Connectivity: CANbus, I²C, SPI, UART/USART, USB Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	In Stock7,920

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