Embedded Processors & Controllers

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FPGAs (Field Programmable Gate Array) with Microcontrollers (69)
Microcontroller, Microprocessor, FPGA Modules (903)
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SoC (System On Chip) (2,134)

Records 108,692

Page 3600/3624

Part Number	Description	In Stock
M2S060TS-VF400 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock7,704
M2S060TS-VF400I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock2,304
M2S060TS-VFG400 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock7,074
M2S060TS-VFG400I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock2,970
M2S060T-VF400 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock2,556
M2S060T-VF400I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock6,588
M2S060T-VFG400 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock4,716
M2S060T-VFG400I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock6,948
M2S060-VF400 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock6,444
M2S060-VF400I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock4,248
M2S060-VFG400 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock5,454
M2S060-VFG400I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock3,618
M2S090-1FCS325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock5,634
M2S090-1FCS325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock2,448
M2S090-1FCSG325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock3,708
M2S090-1FCSG325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock6,516
M2S090-1FG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock6,498
M2S090-1FG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock8,856
M2S090-1FG676 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock4,698
M2S090-1FG676I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock2,898
M2S090-1FG676IX417 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock7,902
M2S090-1FGG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock2,790
M2S090-1FGG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock8,460
M2S090-1FGG676 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock8,874
M2S090-1FGG676I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock3,888
M2S090-FCS325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock5,490
M2S090-FCS325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock4,734
M2S090-FCSG325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock2,826
M2S090-FCSG325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock4,194
M2S090-FG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock3,096

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