Embedded Processors & Controllers

CPLDs (Complex Programmable Logic Devices) (4,299)
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FPGAs (Field Programmable Gate Array) with Microcontrollers (69)
Microcontroller, Microprocessor, FPGA Modules (903)
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SoC (System On Chip) (2,134)

Records 108,692

Page 3582/3624

Part Number	Description	In Stock
A2F500M3G-1PQG208I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 208QFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	In Stock3,526
A2F500M3G-CS288 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock2,664
A2F500M3G-CS288I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock8,496
A2F500M3G-CSG288 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock3,078
A2F500M3G-CSG288I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock2,178
A2F500M3G-FG256 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock4,842
A2F500M3G-FG256I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock7,740
A2F500M3G-FG256M Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock3,690
A2F500M3G-FG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock4,068
A2F500M3G-FG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock2,862
A2F500M3G-FG484M Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock6,858
A2F500M3G-FGG256 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock8,622
A2F500M3G-FGG256I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock6,624
A2F500M3G-FGG256M Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock5,778
A2F500M3G-FGG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock6,132
A2F500M3G-FGG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock429
A2F500M3G-FGG484M Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock5,526
A2F500M3G-PQ208 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 208QFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	In Stock5,130
A2F500M3G-PQ208I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 208QFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	In Stock7,974
A2F500M3G-PQG208 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 208QFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	In Stock8,946
A2F500M3G-PQG208I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 208QFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	In Stock7,812
BCM33838MKFEBG Broadcom	SoC (System On Chip) MODEM DOCSIS 3.0 8X4 Manufacturer: Broadcom Limited Series: - Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	In Stock8,244
BCM33838MKFEBG-B2P Broadcom	SoC (System On Chip) MODEM DOCSIS 3.0 8X4 Manufacturer: Broadcom Limited Series: - Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	In Stock3,762
BCM33838MKFEBG-C2C Broadcom	SoC (System On Chip) MODEM DOCSIS 3.0 8X4 Manufacturer: Broadcom Limited Series: - Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	In Stock8,298
BCM33843DIFSBG Broadcom	SoC (System On Chip) CABLE MODEM Manufacturer: Broadcom Limited Series: * Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	In Stock4,932
BCM33843DUIFSBG Broadcom	SoC (System On Chip) CABLE MODEM Manufacturer: Broadcom Limited Series: * Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	In Stock2,100
BCM33843DUKFSBG Broadcom	SoC (System On Chip) CABLE MODEM Manufacturer: Broadcom Limited Series: * Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	In Stock5,760
BCM33843EKFSBG Broadcom	SoC (System On Chip) DOCSIS 3.0 CABLE MODEM Manufacturer: Broadcom Limited Series: * Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	In Stock6,246
BCM33843EUKFSBG Broadcom	SoC (System On Chip) CABLE MODEM Manufacturer: Broadcom Limited Series: * Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	In Stock7,452
BCM33843GIFSBG Broadcom	SoC (System On Chip) CABLE MODEM Manufacturer: Broadcom Limited Series: * Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	In Stock2,124

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