Embedded Processors & Controllers

CPLDs (Complex Programmable Logic Devices) (4,299)
DSP (Digital Signal Processors) (2,607)
FPGAs (Field Programmable Gate Array) (21,636)
FPGAs (Field Programmable Gate Array) with Microcontrollers (69)
Microcontroller, Microprocessor, FPGA Modules (903)
Microcontrollers (69,011)
Microcontrollers - Application Specific (1,456)
Microprocessors (6,265)
PLDs (Programmable Logic Device) (312)
SoC (System On Chip) (2,134)

Records 108,692

Page 3580/3624

Part Number	Description	In Stock
A2F060M3E-FG256I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock5,634
A2F060M3E-FG256M Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock5,094
A2F060M3E-FGG256 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock5,040
A2F060M3E-FGG256I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock7,524
A2F060M3E-FGG256M Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock5,850
A2F060M3E-TQ144 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 144TQFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	In Stock6,966
A2F060M3E-TQ144I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 144TQFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	In Stock2,898
A2F060M3E-TQG144 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 144TQFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	In Stock6,426
A2F060M3E-TQG144I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 144TQFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	In Stock2,898
A2F200M3F-1CS288 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock5,040
A2F200M3F-1CS288I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock5,400
A2F200M3F-1CSG288 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock6,768
A2F200M3F-1CSG288I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock8,550
A2F200M3F-1FG256 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock6,732
A2F200M3F-1FG256I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock4,986
A2F200M3F-1FG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock3,204
A2F200M3F-1FG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock6,228
A2F200M3F-1FGG256 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock2,214
A2F200M3F-1FGG256I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock7,776
A2F200M3F-1FGG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock8,118
A2F200M3F-1FGG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock7,452
A2F200M3F-1PQ208 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 208QFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	In Stock3,510
A2F200M3F-1PQ208I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 208QFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	In Stock3,114
A2F200M3F-1PQG208 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 208QFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	In Stock4,086
A2F200M3F-1PQG208I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 208QFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	In Stock5,940
A2F200M3F-CS288 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock7,956
A2F200M3F-CS288I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock7,722
A2F200M3F-CSG288 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock4,176
A2F200M3F-CSG288I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock2,880
A2F200M3F-FG256 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock2,160

«
‹
1
...
3577
3578
3579
3580 (current)
3581
3582
3583
...
3624
›
»

Send Message

Certifications

Embedded Processors & Controllers

Resources

Support

Social Media

Need Help?
Send Message