BCM33838MKFEBG-B2P
For Reference Only
| Part Number | BCM33838MKFEBG-B2P |
| PNEDA Part # | BCM33838MKFEBG-B2P |
| Description | MODEM DOCSIS 3.0 8X4 |
| Manufacturer | Broadcom |
| Unit Price | Request a Quote |
| In Stock | 3,762 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 23 - Mar 28 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
|
Free shipping on orders over $100. PNEDA is willing to provide you with better services.
|
|
|
|
|
BCM33838MKFEBG-B2P Resources
| Brand | Broadcom |
| ECAD Module |
|
| Mfr. Part Number | BCM33838MKFEBG-B2P |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
Payment Method
- Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
- If you need the detailed invoice or tax ID,please email us.
- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
- Please confirm the specifications of the products when ordering.
- If you have special order instructions,please note it on the ordering pages.
- Registered users can log in to the account to view the order status.
- You can email us to change the order details before shipment.
- Orders cannot be canceled after shipping the packages.
At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.
Our approach is built around proving our clients with three key advantages:
Prompt Responsiveness
Our team responds quickly to your requests, and gets to work immediately to find your parts.
Guaranteed Quality
Our quality-control processes guard against counterfeits while ensuring reliability and performance.
Global Access
Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.
Hot search vocabulary
- BCM33838MKFEBG-B2P Datasheet
- where to find BCM33838MKFEBG-B2P
- Broadcom
- Broadcom BCM33838MKFEBG-B2P
- BCM33838MKFEBG-B2P PDF Datasheet
- BCM33838MKFEBG-B2P Stock
- BCM33838MKFEBG-B2P Pinout
- Datasheet BCM33838MKFEBG-B2P
- BCM33838MKFEBG-B2P Supplier
- Broadcom Distributor
- BCM33838MKFEBG-B2P Price
- BCM33838MKFEBG-B2P Distributor
BCM33838MKFEBG-B2P Specifications
| Manufacturer | Broadcom Limited |
| Series | - |
| Architecture | - |
| Core Processor | - |
| Flash Size | - |
| RAM Size | - |
| Peripherals | - |
| Connectivity | - |
| Speed | - |
| Primary Attributes | - |
| Operating Temperature | - |
| Package / Case | - |
| Supplier Device Package | - |
The Products You May Be Interested In
|
Manufacturer Xilinx Inc. Series Zynq®-7000 Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 667MHz Primary Attributes Artix™-7 FPGA, 28K Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 400-LFBGA, CSPBGA Supplier Device Package 400-CSPBGA (17x17) |
Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 660K Logic Elements Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1152-BBGA, FCBGA Supplier Device Package 1152-FBGA, FC (35x35) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 10K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
Manufacturer Xilinx Inc. Series Zynq®-7000 Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 800MHz Primary Attributes Kintex™-7 FPGA, 350K Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 900-BBGA, FCBGA Supplier Device Package 900-FCBGA (31x31) |
Manufacturer Xilinx Inc. Series Zynq®-7000 Architecture MCU, FPGA Core Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 766MHz Primary Attributes Artix™-7 FPGA, 23K Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 225-LFBGA, CSPBGA Supplier Device Package 225-CSPBGA (13x13) |
