Embedded Processors & Controllers

CPLDs (Complex Programmable Logic Devices) (4,299)
DSP (Digital Signal Processors) (2,607)
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FPGAs (Field Programmable Gate Array) with Microcontrollers (69)
Microcontroller, Microprocessor, FPGA Modules (903)
Microcontrollers (69,011)
Microcontrollers - Application Specific (1,456)
Microprocessors (6,265)
PLDs (Programmable Logic Device) (312)
SoC (System On Chip) (2,134)

Records 108,692

Page 3579/3624

Part Number	Description	In Stock
5CSXFC6C6U23I7N Intel	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 672UBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	In Stock157
5CSXFC6C6U23I7NES Intel	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 672UBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	In Stock5,184
5CSXFC6C6U23I7NTS Intel	SoC (System On Chip) IC SOC CORTEX-A9 925MHZ 672UBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	In Stock3,978
5CSXFC6D6F31A7N Intel	SoC (System On Chip) IC SOC CORTEX-A9 700MHZ 896FBGA Manufacturer: Intel Series: Automotive, AEC-Q100, Cyclone® V SE Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock8,532
5CSXFC6D6F31C6N Intel	SoC (System On Chip) IC SOC CORTEX-A9 925MHZ 896FBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock1
5CSXFC6D6F31C7N Intel	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 896FBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock8,874
5CSXFC6D6F31C8N Intel	SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 896FBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock7,866
5CSXFC6D6F31C8NES Intel	SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 896FBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock3,294
5CSXFC6D6F31I7 Intel	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 896FBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock8,406
5CSXFC6D6F31I7N Intel	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 896FBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock416
5CSXFC6D6F31I7NES Intel	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 896FBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock6,534
A2F060M3E-1CS288 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock8,982
A2F060M3E-1CS288I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock5,418
A2F060M3E-1CSG288 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock8,082
A2F060M3E-1CSG288I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock3,798
A2F060M3E-1FG256 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock2,718
A2F060M3E-1FG256I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock4,914
A2F060M3E-1FG256M Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock5,202
A2F060M3E-1FGG256 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock8,172
A2F060M3E-1FGG256I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock2,214
A2F060M3E-1FGG256M Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock6,192
A2F060M3E-1TQ144 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 144TQFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	In Stock3,636
A2F060M3E-1TQ144I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 144TQFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	In Stock6,120
A2F060M3E-1TQG144 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 144TQFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	In Stock2,610
A2F060M3E-1TQG144I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 144TQFP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	In Stock4,500
A2F060M3E-CS288 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock8,370
A2F060M3E-CS288I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock6,444
A2F060M3E-CSG288 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock6,732
A2F060M3E-CSG288I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11)	In Stock5,364
A2F060M3E-FG256 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA Manufacturer: Microsemi Corporation Series: SmartFusion® Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I²C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	In Stock7,560

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