Technology Articles

2012-01 Connectors Maxwell Technologies

[Jan 8 2012] Marvell announced the launch of a new generation of forward-looking platforms that will enable major breakthroughs in the convergence of TV, gaming, streaming, web browsing and social media applications. The platform is equipped with the Marvell ARMADA 1500 HD media single-chip system and has been adopted by the next generation Google TV, which will debut at CES 2012. With Marvell's superior Qdeo ...

2012-01 Power Renesas Electronics America

[Jan 7 2012] Renesas Electronics, Inc., a leading global supplier of advanced semiconductors and solutions, has announced the development of the industry's first 40nm process embedded flash memory technology for automotive real-time applications. Renesas will also be the first to introduce 40nm embedded flash microcontrollers (MCUS) for automotive applications using the 40nm process flash technology, with the ...

2012-01 Power Xilinx

[Jan 6 2012] Xilinx announced a new target reference design and new development substrate based on the 28 nm Kintex™-7 FPGA to accelerate the development of a new generation of 3D and 4K2K display technologies designed to bring richer immersive experiences to consumers. Includes 4K2K Mosaic, HDTV to 4K2K updrive target reference designs, and a new ACDC (Capture, Provide, Distribute, Consume) 1.0 substrate wit ...

2012-01 Connectors Renesas Electronics America

[Jan 5 2012] Renesas Electronics, Inc., a leading global supplier of advanced semiconductors and solutions, has announced the development of the industry's first 40nm process embedded flash memory technology for automotive real-time applications. Renesas will also be the first to introduce 40nm embedded flash microcontrollers (MCUS) for automotive applications using the 40nm process flash technology, with the ...

2012-01 Sensors Maxim Integrated

[Jan 4 2012] Maxim Integrated Products introduces the MAX44000 digital ambient light and infrared proximity detection sensor that simulates the ambient light detection of the human eye. Designed with the company's proprietary BiCMOS technology, the IC integrates three optical sensors, two ADCs, and digital circuits in a miniature, 2mm x 2mm x 0.6mm package. The highly integrated design saves valuable board sp ...

2012-01 Connectors STMicroelectronics

[Jan 3 2012] STMicroelectronics has announced an inertial sensor module that integrates triaxial acceleration and angular velocity sensors in a 3x5.5x1mm miniature package. The new product is a six-degree-of-freedom iNEMO sensor module, nearly 20% smaller than ST's existing products, and brings advanced motion sensing capabilities to today's space-constrained consumer electronics applications (such as smartph ...

2012-01 Power Molex

[Jan 2 2012] Molex expands its CMC product line with a pin-compatible 1 54 circuit connector, as well as 32 and 112 circuit soldered mounting connectors. Designed specifically for high conductivity and harsh environment applications, the CMC is the industry standard interface for automotive and transportation powertrain applications, including engine control units (ECUs), automatic transmissions, suspension c ...

2012-01 Semiconductors STMicroelectronics

[Jan 1 2012] STMicroelectronics, a leading global semiconductor supplier across multiple electronic applications, introduces the MDmesh V power MOSFET transistor that breaks the world record for high voltage power MOSFET transistors. The MDmesh V series is already the highest performing power MOSFET transistor on the market, with the lowest on-state resistance per unit area for the highest energy efficiency a ...

2010-01 Connectors Maxim Integrated

[Jan 11 2010] Maxim has introduced two small, battery-powered LNA (Low Noise Amplifier) models, the MAX2657 and MAX2658, designed for use in the 1575MHz band with GPS capabilities. The two devices combine Maxim's innovative SiGe BiCMOS process and WLP (chip level package) technology with a noise factor of only 0.8dB, greatly improving GPS reception sensitivity. This sensitivity is superior to discrete GaAs and ...

2010-01 Semiconductors NXP

[Jan 10 2010] As the television industry begins to embrace silicon tuners, NXP Semiconductors announced the TDA18272, a high-performance silicon tuner for global wireless and cable TV reception. The DVB-T2-TDA18272 supports all analog and digital TV standards worldwide, enabling TV manufacturers to prepare for the next generation of TVS. To date, NXP has sold more than 400 million NXP Silicon tuners, contribut ...

2010-01 Semiconductors Analog Devices

[Jan 9 2010] Analog Devices, the world's leading provider of high-performance signal processing solutions, recently introduced a highly integrated RFIC (Radio frequency Integrated circuit) family designed for LTE (Long Term Evolution) and fourth generation (4G) cell base stations. LTE is an enhanced version of the UMTS (Universal Mobile Telecommunications System) standard, which is seen as the ultimate step t ...

2010-01 Power Samsung

[Jan 8 2010] Samsung Electronics Co., Ltd. has announced that it has developed the first LTE(Long Term Evolution) mobile phone modem and that the modem meets the latest 3GPP standard released in March 2009. Utilizing 3GPP version 8 of the standard, this LTE modem is ahead of the industry standard released in December 2008. The Kalmia modem has two receiving and transmitting antennas (MIMO 2X2) and can support ...