Technology Articles

2015-05 Power Microchip Technology

[May 20 2015] Micron Technology and Intel Corporation have jointly developed the world's densest 3D NAND flash memory technology. Flash memory is the storage technology used in the lightest laptops, the fastest data centers, and almost all phones, tablets, and mobile devices. This latest 3D NAND technology, developed by Intel and Micron, vertically stacks multiple layers of data storage units with remarkable p ...

2015-05 Power Microchip Technology

[May 19 2015] Microchip announced that MOST Cooperation has released the latest MOST150 technology coaxial physical layer specification. With the release of the new industry standard specification, Microchip can connect the smart antenna module to the vehicle's MOST150 Advanced Driver Assistance System (ADAS) and infotainment network through an OS81118AF Intelligent Network Interface Controller (INIC) equipped ...

2015-05 Semiconductors Vishay

[May 19 2015] Vishay Intertechnology announced the release of the new 8mm x 8mm x 1.8mm PowerPAK 8x8L in 40V TrenchFET power MOSFET-SQJQ402E, The goal is to provide alternatives to common D2PAK and DPAK packages for automotive applications that achieve high current and save space and power. The 40V TrenchFET power MOSFETs are the industry's first 8mm x 8mm placeholder, AEC-Q101-certified MOSFETs in an 8mm x 8m ...

2015-05 Semiconductors Silicon Labs

[May 18 2015] Silicon Labs, a leading provider of microcontrollers, wireless connectivity, analog and sensor solutions for the Internet of Things (IoT), has announced the launch of a digital audio bridge chip and evaluation kit designed to simplify the development of accessories for iOS devices. The new CP2614 interface IC provides a complete turnkey audio bridge solution for a wide range of MFi (Made for iPod ...

2015-05 Power Infineon Technologies

[May 18 2015] Infineon Technologies AG has introduced the OptiMOS™ 5 25V and 30V product families, a new generation of power MOSFETs in standard discrete packages. At the same time, Infineon also released a new Power module called Power Block and an integrated power module DrMOS 5x5. Together with drives and digital controllers, Infineon offers complete system solutions for servers, computers, data communicati ...

2015-05 Passive Components Vishay

[May 17 2015] Vishay has announced a new bi-symmetric (BiSy) single-wire ESD protection diode, the VBUS05B1-SD0, in an ultra-small CLP0603 package for portable electronics. Measuring just 0.6mm x 0.3mm and as low as 0.27mm in height, Vishay Semiconductors VBUS05B1-SD0 features ultra-low capacitance and leakage current to protect high-speed data lines and antennas from transient voltage signals. The VBUS05B1-SD ...

2015-05 Connectors Texas Instruments

[May 17 2015] TI has announced the launch of its industry's lowest-power 32-bit ARM Cortex-M4F MCU, the MSP432TM microcontroller (MCU) platform. These new 48MHz MCUS leverage TI's expertise in ultra-low power MCUS to optimize performance while avoiding power loss, with effective and standby power consumption of only 95µA/MHz and 850nA, respectively. Industry-leading integrated simulators such as high-speed 14- ...

2015-05 Power Broadcom

[May 16 2015] Broadcom announced the launch of a new HD set-top box System-on-a-chip (HD STB SoC) for the China Free (FTA) satellite market. With the rapid growth in the promotion of high-definition programming in China, Broadcom's BCM7228 chip can support satellite TV operators to promote more advanced services and improve high-definition satellite broadcast transmission capabilities by integrating broadcast ...

2015-05 Connectors Linear Technology/Analog Devices

[May 16 2015] Linear introduced the LTC3887, a dual-channel output synchronous step-down DC/DC controller with an I2C-based PMBus interface for digital power system management. The LTC3887 differs from the previously released LTC3880 in that it has an enhanced feature set, including a faster 70ms power-on time, higher output voltage capability, and a fast ADC mode that provides an 8ms update rate for one param ...

2015-05 Connectors Silicon Labs

[May 15 2015] Silicon Labs has announced a new complete line of receiver/audio processors and multi-standard digital radio ics, designed to deliver the best AM/FM and digital radio performance for the global automotive radio market. The Si479xx AM/FM receiver and digital radio tuner family with on-chip audio processing sets a new benchmark for in-car radio reception performance at the lowest system cost. The n ...

2015-05 Power Broadcom

[May 15 2015] Broadcom announced the launch of a new cost-effective, compact DOCSIS® 3.0 set-top box (STB) for the growing Chinese cable TV market. The new product offers more advanced features to Chinese cable TV subscribers, including Over-the-top (OTT) video content, broadband data services, and wired and wireless home networks. For more news, please visit the Broadcom press room. Broadcom's new cable set-t ...

2015-05 Semiconductors Dialog Semiconductor GmbH

[May 14 2015] Dialog Semiconductor Corporation announced the addition of three new products to its successful line of ultra-low power Smart Bluetooth SOCs - the DA14581, DA14582 and DA14583. They are currently the smallest and lowest power wireless connectivity solutions for wireless charging and remote control (RCU) applications in the Internet of Things (IoT) and are targeted specifically for high-volume, hi ...