Embedded Processors & Controllers

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FPGAs (Field Programmable Gate Array) with Microcontrollers (69)
Microcontroller, Microprocessor, FPGA Modules (903)
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SoC (System On Chip) (2,134)

Records 108,692

Page 3597/3624

Part Number	Description	In Stock
M2S060-1FCS325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock6,966
M2S060-1FCSG325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock2,196
M2S060-1FCSG325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock2,160
M2S060-1FG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock2,484
M2S060-1FG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock3,636
M2S060-1FG676 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock8,532
M2S060-1FG676I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock3,472
M2S060-1FGG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock3,472
M2S060-1FGG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock8,550
M2S060-1FGG676 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock6,156
M2S060-1FGG676I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock5,598
M2S060-1VF400 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock3,060
M2S060-1VF400I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock7,290
M2S060-1VFG400 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock2,862
M2S060-1VFG400I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock3,562
M2S060-FCS325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock6,372
M2S060-FCS325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock6,804
M2S060-FCSG325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock4,320
M2S060-FCSG325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock8,010
M2S060-FG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock8,496
M2S060-FG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock2,034
M2S060-FG676 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock5,580
M2S060-FG676I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock6,624
M2S060-FGG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock5,994
M2S060-FGG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock6,300
M2S060-FGG676 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock4,230
M2S060-FGG676I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock5,328
M2S060T-1FCS325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock6,192
M2S060T-1FCS325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock7,884
M2S060T-1FCSG325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock8,334

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