Embedded Processors & Controllers

CPLDs (Complex Programmable Logic Devices) (4,299)
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FPGAs (Field Programmable Gate Array) with Microcontrollers (69)
Microcontroller, Microprocessor, FPGA Modules (903)
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SoC (System On Chip) (2,134)

Records 108,692

Page 3594/3624

Part Number	Description	In Stock
M2S050-FCSG325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock3,384
M2S050-FCSG325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock3,024
M2S050-FG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock7,974
M2S050-FG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock8,352
M2S050-FG896 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock8,028
M2S050-FG896I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock7,488
M2S050-FGG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock8,154
M2S050-FGG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock5,292
M2S050-FGG896 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock7,020
M2S050-FGG896I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock3,888
M2S050S-1FG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock3,186
M2S050S-1FG896I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock2,538
M2S050S-1FGG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock3,798
M2S050S-1FGG896I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock6,876
M2S050S-1VF400I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock4,698
M2S050S-1VFG400I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	In Stock5,184
M2S050T-1FCS325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock3,544
M2S050T-1FCS325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock2,970
M2S050T-1FCSG325 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock5,328
M2S050T-1FCSG325I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 325-TFBGA, CSPBGA Supplier Device Package: 325-CSPBGA (11x11)	In Stock2,052
M2S050T-1FG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock2,592
M2S050T-1FG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock3,472
M2S050T-1FG484M Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock4,590
M2S050T-1FG896 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock6,480
M2S050T-1FG896I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock7,002
M2S050T-1FGG484 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock2,862
M2S050T-1FGG484I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock5,130
M2S050T-1FGG484M Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	In Stock8,280
M2S050T-1FGG896 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock3,078
M2S050T-1FGG896I Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock3,240

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