Technology Articles

2018-01 Power Vicor

[Jan 17 2018] Vicor Cool-Power ZVS regulators deliver more power at higher temperatures than competing products without compromising power density or efficiency. Important attributes of Cool-PowerZVS regulator performance include zero-voltage switching topology, high silicon chip integration, and high-density LGA SiP packages. These high performance regulators are also simple to use, ensuring a one-time design ...

2018-01 Connectors Xilinx

[Jan 16 2018] Xilinx Corporation, a global leader in AllProgrammable technology and devices, announced the launch of the automotion-grade Zynq UItraScale+TMMPSoC family of devices that support the development of safety-critical ADAS and autonomous driving systems. The Xilinx Automotive Class XAZynqUItraScale+MPSoC series has not only passed the AECQ100 test specification, but also fully complies with ISO26262A ...

2018-01 Connectors ams

[Jan 15 2018] Ams introduced the AS7265X, a cost-effective 18-channel multispectral sensor solution that opens the imagination to new spectral sensing applications. The 18-channel 3 chip calibrates visible light with a near-infrared chipset, making it ideal for emerging spectral sensing applications such as horticulture, fluid mass/spectral composition analysis, and complex spectral identification (anti-counte ...

2018-01 Power SANYO Semiconductor

[Jan 14 2018] LEDVANCE, a manufacturer of general lighting products under the SYLVANIA brand, introduces the world's first Bluetooth OMesh LED lighting product SYLVANIASMART+ Bluetooth full-color LEDA19 bulbs and indoor full-color LED flexible light strips based on Cypress Bluetooth Low Energy (BLE) technology. Soft white LEDA19 filament and spherical bulb. Bluetooth technology is a simple and secure global st ...

2018-01 Power Phihong USA

[Jan 13 2018] Plantronics, a leading brand in audio and wearable technology, has announced a new BackBeat FITBoost enhanced wireless Sports Bluetooth headset, further enriching the Plantronics Sports Headset product line. BackBeatFIT series of wireless sports headphones are designed for users who love sports and meet the needs of different levels of exercise and fitness. The new BackBeatFITBoost has an exclusi ...

2018-01 Passive Components Vishay

[Jan 12 2018] Vishay Intertechnology has announced the introduction of a new series of HI-TMP tantalum shell sealed liquid tantalum capacitors, the T34, which can operate at high temperatures of +200°C. The T34 series axial-lead through-hole devices offer increased reliability, improved resistance to mechanical shock and vibration, and longer service life for industrial and petroleum exploration applications. ...

2018-01 Sensors Cypress Semiconductor

[Jan 12 2018] Cypress Semiconductor, Inc. announced that OuraHealth's new Oura Smart Ring features the industry's lowest power and most flexible dual-core MCU with built-in Bluetooth Low Power (BLE) wireless connectivity, a Cypress PSoC6BLE microcontroller (MCU). Cypress's secure PSoC6MCU architecture enables Oura users to support continuous tracking of sleep, physical recovery and daily activities for up to s ...

2018-01 Semiconductors Cypress Semiconductor

[Jan 11 2018] Cypress Semiconductor announced the launch of a Combo solution for in-vehicle wireless connectivity that provides robust and stable 2x2MIMO802.11acWi-Fi and Bluetooth connectivity for vehicles, enabling multiple users to connect devices simultaneously and deliver content independently on their own devices. The Cypress CYW89359Combo solution is the first in the industry to use real-time synchronou ...

2018-01 Power Qorvo US Inc.

[Jan 11 2018] Qorvo announced that the Qorvo front-end power Amplifier (PA) will be used by Qualcomm subsidiary Qualcomm Technologies,Inc. Qualcomm Cellular Vehicle Networking (C-V2X) reference design. Qorvo's new GaAsHBT PA is the only C-V2X enabled power amplifier designed to enhance road safety awareness and improve driver assistance. The solution delivers industry-leading performance, improves linear outpu ...

2018-01 Semiconductors STMicroelectronics

[Jan 10 2018] STMicroelectronics and GLOBALFOUNDRIES announced that ST has selected the 22 nm FD-SOI(22FD@) technology platform to power its next-generation processor solutions for industrial and consumer applications. Following the deployment of the industry's first 28 nm FD-SOI technology platform, ST is expanding its business roadmap by leveraging GF's production-ready 22FDX process and ecosystem to provide ...

2018-01 Semiconductors STMicroelectronics

[Jan 9 2018] At CES 2018, ST, Cinemo, and Valens are jointly demonstrating an optimized in-vehicle infotainment multimedia system. The software engine for the system is Cinemo's Distributed PlaybackTM in-vehicle media distribution system, which is connected to Valens' HDBaseT Automotive technology. The hardware platform is ST's Accordo5 automotive infotainment processor and Telemaco3P automotive information s ...

2018-01 Semiconductors Lattice Semiconductor Corporation

[Jan 8 2018] Lattice Semiconductor has announced that its SiBEAM SnapM technology will be integrated into Fujitsu's next-generation Q508 tablet. The Q508 will be the first tablet to support USB3.1 data transfer wirelessly with 5Gbps, "said Susumu Nikawa, Chief Technology Officer, Fujitsu Client Computing, Inc." SiBEAM Snap technology optimizes the performance of battery-powered applications and provides seaml ...