XCZU7CG-L1FFVC1156I
For Reference Only
| Part Number | XCZU7CG-L1FFVC1156I |
| PNEDA Part # | XCZU7CG-L1FFVC1156I |
| Description | IC SOC CORTEX-A53 1156FCBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 6,786 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 5 - Apr 10 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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XCZU7CG-L1FFVC1156I Resources
| Brand | Xilinx |
| ECAD Module |
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| Mfr. Part Number | XCZU7CG-L1FFVC1156I |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
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XCZU7CG-L1FFVC1156I Specifications
| Manufacturer | Xilinx Inc. |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
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Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 512KB RAM Size 64KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed 100MHz Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 288-TFBGA, CSPBGA Supplier Device Package 288-CSP (11x11) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 50K Logic Modules Operating Temperature -55°C ~ 125°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
