XCZU19EG-3FFVD1760E Datasheet
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Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FCBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FCBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1924-BBGA, FCBGA Supplier Device Package 1924-FCBGA (45x45) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FCBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 533MHz, 600MHz, 1.3GHz Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FCBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 533MHz, 600MHz, 1.3GHz Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FCBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1924-BBGA, FCBGA Supplier Device Package 1924-FCBGA (45x45) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FCBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1517-BBGA, FCBGA Supplier Device Package 1517-FCBGA (40x40) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 533MHz, 600MHz, 1.3GHz Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FCBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 533MHz, 600MHz, 1.3GHz Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FCBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 533MHz, 600MHz, 1.3GHz Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1924-BBGA, FCBGA Supplier Device Package 1924-FCBGA (45x45) |
