XC7Z030-2FBG676E
For Reference Only
| Part Number | XC7Z030-2FBG676E |
| PNEDA Part # | XC7Z030-2FBG676E |
| Description | IC SOC CORTEX-A9 800MHZ 676FCBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 11 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 19 - Mar 24 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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XC7Z030-2FBG676E Resources
| Brand | Xilinx |
| ECAD Module |
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| Mfr. Part Number | XC7Z030-2FBG676E |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
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XC7Z030-2FBG676E Specifications
| Manufacturer | Xilinx Inc. |
| Series | Zynq®-7000 |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
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Manufacturer Xilinx Inc. Series Zynq®-7000 Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 667MHz Primary Attributes Kintex™-7 FPGA, 350K Logic Cells Operating Temperature 0°C ~ 85°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA (27x27) |
Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 270K Logic Elements Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1152-BBGA, FCBGA Supplier Device Package 1152-FBGA, FC (35x35) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 60K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 400-LFBGA Supplier Device Package 400-VFBGA (17x17) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 25K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-LFBGA Supplier Device Package 256-FPBGA (14x14) |
Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 480K Logic Elements Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1152-BBGA, FCBGA Supplier Device Package 1152-FBGA, FC (35x35) |
