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XC7Z045-1FFG676C

XC7Z045-1FFG676C

For Reference Only

Part Number XC7Z045-1FFG676C
PNEDA Part # XC7Z045-1FFG676C
Description IC SOC CORTEX-A9 667MHZ 676FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 7,830
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Nov 25 - Nov 30 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XC7Z045-1FFG676C Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXC7Z045-1FFG676C
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XC7Z045-1FFG676C, XC7Z045-1FFG676C Datasheet (Total Pages: 25, Size: 716.41 KB)
PDFXC7Z045-2FBG676CES Datasheet Cover
XC7Z045-2FBG676CES Datasheet Page 2 XC7Z045-2FBG676CES Datasheet Page 3 XC7Z045-2FBG676CES Datasheet Page 4 XC7Z045-2FBG676CES Datasheet Page 5 XC7Z045-2FBG676CES Datasheet Page 6 XC7Z045-2FBG676CES Datasheet Page 7 XC7Z045-2FBG676CES Datasheet Page 8 XC7Z045-2FBG676CES Datasheet Page 9 XC7Z045-2FBG676CES Datasheet Page 10 XC7Z045-2FBG676CES Datasheet Page 11

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XC7Z045-1FFG676C Specifications

ManufacturerXilinx Inc.
SeriesZynq®-7000
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)

The Products You May Be Interested In

Manufacturer

Xilinx Inc.

Series

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Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

800MHz

Primary Attributes

Kintex™-7 FPGA, 125K Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

676-BBGA, FCBGA

Supplier Device Package

676-FCBGA (27x27)

Manufacturer

Xilinx Inc.

Series

Zynq®-7000

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

766MHz

Primary Attributes

Artix™-7 FPGA, 28K Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

225-LFBGA, CSPBGA

Supplier Device Package

225-CSPBGA (13x13)

Manufacturer

Intel

Series

Arria 10 SX

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

1.5GHz

Primary Attributes

FPGA - 570K Logic Elements

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1517-BBGA, FCBGA

Supplier Device Package

1517-FBGA, FC (40x40)

A2F200M3F-FGG484

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®

Architecture

MCU, FPGA

Core Processor

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Flash Size

256KB

RAM Size

64KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, SPI, UART/USART

Speed

80MHz

Primary Attributes

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

484-BGA

Supplier Device Package

484-FPBGA (23x23)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 600MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

484-BFBGA, FCBGA

Supplier Device Package

484-FCBGA (19x19)

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