EP3C25F256C7N
For Reference Only
| Part Number | EP3C25F256C7N |
| PNEDA Part # | EP3C25F256C7N |
| Description | IC FPGA 156 I/O 256FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 1,912 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 25 - Nov 30 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP3C25F256C7N Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP3C25F256C7N |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP3C25F256C7N Specifications
| Manufacturer | Intel |
| Series | Cyclone® III |
| Number of LABs/CLBs | 1539 |
| Number of Logic Elements/Cells | 24624 |
| Total RAM Bits | 608256 |
| Number of I/O | 156 |
| Number of Gates | - |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FBGA (17x17) |
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Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 56340 Total RAM Bits 1869824 Number of I/O 377 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 896-BGA Supplier Device Package 896-FBGA (31x31) |
