EP1K50FC256-3AA
For Reference Only
| Part Number | EP1K50FC256-3AA |
| PNEDA Part # | EP1K50FC256-3AA |
| Description | IC FPGA 186 I/O 256FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 5,868 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Feb 19 - Feb 24 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP1K50FC256-3AA Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP1K50FC256-3AA |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP1K50FC256-3AA Specifications
| Manufacturer | Intel |
| Series | ACEX-1K® |
| Number of LABs/CLBs | 360 |
| Number of Logic Elements/Cells | 2880 |
| Total RAM Bits | 40960 |
| Number of I/O | 186 |
| Number of Gates | 199000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package / Case | 256-BBGA |
| Supplier Device Package | 256-FBGA (17x17) |
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Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 276480 Number of I/O 223 Number of Gates 1500000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 146124 Total RAM Bits 5120000 Number of I/O 574 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1152-BBGA, FCBGA Supplier Device Package 1152-FCBGA (35x35) |
Manufacturer Microsemi Corporation Series ProASIC3 Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 18432 Number of I/O 91 Number of Gates 60000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
