10AS066N1F40E1HG
For Reference Only
Part Number | 10AS066N1F40E1HG |
PNEDA Part # | 10AS066N1F40E1HG |
Description | IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
Manufacturer | Intel |
Unit Price | Request a Quote |
In Stock | 5,904 |
Warehouses | Shipped from Hong Kong SAR |
Estimated Delivery | Nov 24 - Nov 29 (Choose Expedited Shipping) |
Guarantee | Up to 1 year [PNEDA-Warranty]* |
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10AS066N1F40E1HG Resources
Brand | Intel |
ECAD Module | |
Mfr. Part Number | 10AS066N1F40E1HG |
Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
Datasheet |
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10AS066N1F40E1HG Specifications
Manufacturer | Intel |
Series | Arria 10 SX |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size | - |
RAM Size | 256KB |
Peripherals | DMA, POR, WDT |
Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 1.5GHz |
Primary Attributes | FPGA - 660K Logic Elements |
Operating Temperature | 0°C ~ 100°C (TJ) |
Package / Case | 1517-BBGA, FCBGA |
Supplier Device Package | 1517-FBGA, FC (40x40) |
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Intel Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 570K Logic Elements Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1517-BBGA, FCBGA Supplier Device Package 1517-FBGA, FC (40x40) |
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Microsemi Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 512KB RAM Size 64KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Intel Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 570K Logic Elements Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1517-BBGA, FCBGA Supplier Device Package 1517-FBGA, FC (40x40) |
Xilinx Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC CG Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 784-BFBGA, FCBGA Supplier Device Package 784-FCBGA (23x23) |