10AS057K1F40E1SG
For Reference Only
Part Number | 10AS057K1F40E1SG |
PNEDA Part # | 10AS057K1F40E1SG |
Description | IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
Manufacturer | Intel |
Unit Price | Request a Quote |
In Stock | 8,352 |
Warehouses | Shipped from Hong Kong SAR |
Estimated Delivery | Nov 24 - Nov 29 (Choose Expedited Shipping) |
Guarantee | Up to 1 year [PNEDA-Warranty]* |
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10AS057K1F40E1SG Resources
Brand | Intel |
ECAD Module | |
Mfr. Part Number | 10AS057K1F40E1SG |
Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
Datasheet |
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10AS057K1F40E1SG Specifications
Manufacturer | Intel |
Series | Arria 10 SX |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size | - |
RAM Size | 256KB |
Peripherals | DMA, POR, WDT |
Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 1.5GHz |
Primary Attributes | FPGA - 570K Logic Elements |
Operating Temperature | 0°C ~ 100°C (TJ) |
Package / Case | 1517-BBGA, FCBGA |
Supplier Device Package | 1517-FBGA, FC (40x40) |
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Intel Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 480K Logic Elements Operating Temperature -40°C ~ 100°C (TJ) Package / Case 780-BBGA, FCBGA Supplier Device Package 780-FBGA, FC (29x29) |
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Xilinx Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC CG Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1156-BBGA, FCBGA Supplier Device Package 1156-FCBGA (35x35) |
Microsemi Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 25K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |