TE Circuit Protection introduces reflow solderable thermal protection devices

     TE Circuit Protection, a business unit of TE Connectivity, today announced the availability of reflow Solderable thermal protection (RTP) devices for rated AC (AC) and rated DC (DC) with a 140°C disconnect temperature (TOPEN). The innovative RTP devices enable quick and easy installation using industry-standard component mount and lead-free reflow equipment, ensuring manufacturers achieve significant cost reductions as they transition from manual assembly to the Surface Mount device (SMD) process. The new RTP140R060S (AC) and RTP140R060SD (DC) devices provide designers with a more convenient and cost-effective alternative to thermal fuses to protect low-temperature AC or DC applications from potential thermal events.

     The RTP140R060S device for rated AC applications features a series resistance of only 0.7mOhm (typical), a high voltage capacity (250VAC), and a high current AC interrupt rating (80A at 120V AC). The device helps protect against damage caused by overtemperature events in low-temperature AC industrial applications, such as lighting dimmers. Because the dimmer is embedded in the wall, it may be difficult to release heat, causing a thermal event to occur. In addition, MOSFETs used in this type of design fail to enter resistance mode and generate heat resulting in a thermal runaway event. To address space and heat challenges, the RTP140R060S device can be installed on the PCB near the MOSFETs it protects.

     The RTP140R060SD for rated DC applications helps protect MOSFETs from thermal event damage in low-power DC applications such as power tools, electronic monitoring and automotive electronics design. Similar to devices rated for AC applications, the RTP140R060SD device provides a series resistance of only 0.7mOhm (typical value) with an open circuit temperature of 140°C, helping to prevent false trigger action. In addition, the device's high voltage capacity (32VDC) and high current DC interrupt rating (200A at 16V DC) make it particularly suitable for providing robust thermal protection in DC applications where a high level of reliability and safety must be guaranteed.

     TE Circuit Protection's RTP technology uses a one-time electronic activation process to make it heat sensitive, allowing for disconnection at 140°C in the application field. Prior to activation, an RTP device can withstand 3 lead-free solder reflow steps (up to 260°C peak) without disconnecting. Activation can be achieved in system testing or in the actual application field.

     Unlike radial lead thermal fuses, which must be reflow welded before installation, RTP devices allow the use of standard surface mount production methods, thus eliminating the need for some special assembly procedures. The device can also be installed on a dual-panel PCB.

     "The new low-temperature AC/DC rated RTP device is a very important addition to our RTP portfolio," said Faraz Hasan, Global Marketing and business Development Manager, Electrical/Industrial/Lighting Products, TE Circuit Protection. "The new device has the same form factor as the existing RTP200 device, but it has a lower activation temperature."