TDK integrates integrated telemetry into its latest DC-DC converter modules for high power density applications

     TDK has introduced the FS160* series of MicroPOL (μPOL) power modules, which offer superior power density and full telemetry in an ultra-compact size, and are now in mass production. These μPOL DC-DC converters provide enhanced performance while maintaining a very small footprint.

     Measuring just 3.3mm x 3.3mm x 1.35mm, each FS160* module is ideal for integration into designs with ASics, Measuring just 3.3mm x 3.3mm x 1.35mm, each FS160* module is ideal for integration into designs with ASics, SOCs and leading FPgas. The series offers complete telemetry - including voltage, current and temperature monitoring - accessible via an²C interface. These modules are designed to operate over a wide junction temperature range from -40°C to 125°C, ensuring reliability in harsh environments.

     The FS160 series includes several models such as FS1603 (3a), FS1604 (4a) and FS1606 (6a), as well as larger current models such as FS1412 (12a) and FS1525 (25a). By connecting up to eight FS1525 modules in parallel, the series can be extended up to 200a, covering applications ranging from big data and artificial intelligence to 5G, iot and enterprise computing.

     TDK's innovative modular design integrates high-performance controllers, drivers, MOSFETs and logic cores in a semiconductor embedded substrate, eliminating wire keys and improving thermal performance. In addition, the module integrates IC inductors and passive components in the on-chip embedded package, minimizing parasitic inductors and interconnect resistors. This results in higher efficiency, faster response times, and precise voltage regulation under dynamic loads. Starting and Vcc capacitors are also integrated to further optimize performance.

     Thanks to these advancements, the FS160* series converters achieve an industry-leading power density of 1 watt/cubic millimeter, offering modules nearly half the size of comparable solutions. Its superior thermal performance allows it to operate without airflow, with power up to 15 W to 30 W, even when ambient temperatures reach 100°C. Ultimately, TDK's μPOL modules help designers reduce PCB footprint, simplify layout, and reduce overall system costs while providing efficient power conversion.