STMicroelectronics introduces a new series of chipsets for the HD HEVC entry-level set-top box market

     STMicroelectronics, the world's leading semiconductor supplier across multiple electronic applications, introduces the new HD HEVC Liege3 series chipsets. Targeted at the entry-level set-top box market, the new range includes satellite set-top box chipsets (STiH337/STiH332), cable set-top box chipsets (STiH372), and IPTV set-top box chipsets (STiH307/STiH302).

     The new series of chipsets is not only an advanced version of the previous generation, but also introduces the latest architecture and optimized IP of Cannes(STiH310/STiH312/318) products to provide customers with a highly integrated system chip for the future. Assisting operators in the large-scale upgrade of entry-level set-top boxes to High Efficiency Video Coding (HEVC).

     St's new set-top box chipsets benefit from scalable hardware and software architectures that allow device vendors to flexibly configure their product platforms to deliver a higher user experience at an affordable price across different HD HEVC entry-level set-top box markets. The new series of ARM chipsets are all pin-compatible, and different broadcast technologies share the same design, which simplifies development. The software is compatible with ST's Cannes family of SOCs, enabling Oems to easily design innovative client products using a feature-rich development ecosystem that leverages multiple middleware offerings.

     Targeting the satellite TV market, the STiH337/STiH332 System chip will enable a new DVB-S2X demodulation solution, allowing Multiple System Operators (MSO) to benefit from the higher compression efficiency of HEVC technology. The efficiency of the S2X spectrum is improved and the capacity utilization of the satellite transponder is optimized.

     Philippe Notton, Vice President and General Manager of ST's Consumer Electronics Division, said: "Our new family of ARM set-top box chipsets strengthens ST's product offerings across all high-dynamic HD HEVC entry-level broadcast set-top box markets, while demonstrating our commitment to developing innovative solutions and R&D capabilities. With the new Liege3 system chip family, multi-system operators can leverage a chipset platform with the processing power to meet future development needs, maximize the life cycle of HEVC investments, and support all of today's most important new interfaces and spectrum optimized broadcast technologies."