Rohm announces new series of silicon capacitors BTD1RVFL
ROHM Semiconductor has announced the new silicon capacitors BTD1RVFL series. Smartphones and wearable devices will progressively incorporate these components. Silicon semiconductor processing technology has been refined over many years, allowing for greater efficacy in a more compact package.
Smartphones and other devices with growing functionality require smaller components that support high-density mounting. Silicon capacitors using thin-film semiconductor technology can provide higher capacitance in a thinner form factor than existing multilayer ceramic capacitors (MLCCs). At the same time, stable temperature characteristics, along with excellent reliability, are accelerating their adoption in a variety of applications. In anticipation of the growth of the global market for silicon capacitors to 300 billion yen (about 2 billion US dollars) by 2030 (approximately 1.5 times higher than in 2022), ROHM has developed compact high-performance silicon capacitors by leveraging proprietary semiconductor processes.
ROHM’s proprietary RASMID miniaturization technology permits processing in 1µm increments, which eliminates flaking during external formation and improves dimensional tolerances to within ±10µm. This slight variation in product dimension enables a closer spacing between adjacent components when mounting. In addition, the backside electrode used for substrate bonding has been expanded to the package’s periphery to increase mounting strength.
The BTD1RVFL series (BTD1RVFL102 / BTD1RVFL471) contains the smallest 01005-size (0.1inch x 0.05inch) / 0402-size (0.4mm) X 0.2mm) mass-produced surface mount silicon capacitors in the industry. The mounting area is reduced by approximately 55% compared to conventional 0201-size (0.2inch x 0.1inch) / 0603-size (0.6mm x 0.3mm) components, contributing to the miniaturization of applications. In addition, an integrated TVS protection element ensures high ESD resistance and reduces the number of man-hours needed for surge countermeasures and other circuit design elements.
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