Reliability defense capacitors for demanding applications

     Kyocera AVX has released its new TCD series DLA 04051 and COTS-Plus conductive polymer capacitors. These new high-reliability conductive polymer capacitors are designed for demanding aerospace, defense, and industrial applications, including ng power supplies and filter circuits, and comply with the new DLA 04051 defense specification.

     The series of conductive polymer capacitors are currently available in two housing sizes (EIA 1210 and 2917) with lead-free and RoHS-compliant 100% tin terminals or tin/lead (Sn/PB) terminals. They are rated to tolerances of 10-470µF±10 or 20%, 4-50V, and operate at temperatures from -55C to 125C. The new series features high CV, low ESR, low DC leakage (0.1CV), stability, high frequency capacitance retention, long life performance (up to 2000 hours at 125C), and a benign failure mode under recommended use conditions. They have a basic reliability of 0.5% per 1000 hours at 85 ° C and reliably withstand vibration, surge voltage, RTSH and bias humidity tests for at least 500 hours at 85 ° C and 85% relative humidity.

     In addition, capacitors undergo statistical electrical screening and inrush current screening. They are also available with two enhancement test options for the DLA 04051. Test option A tests the component for 2000 hours of life at +125 ° C, and test Option B tests the component for 2000 hours of vibration, surge voltage, RTSH, and life at +125 ° C.

     "KYOCERA AVX offers a broad range of solid conductive polymer electrolytic capacitors that have been tested and proven to meet the unique needs of applications ranging from general and space-constrained electronics to solid-state devices, high voltage, high reliability, automotive and now military electronics applications," said Allen Mayar, global product Manager, KYOCERA AVX. "We are proud to further expand this portfolio with the new TCD family and provide customers in multiple market segments with innovative solutions to meet their demanding board level design challenges."