PANJIT's bridge rectifier provides maximum rated current capacity

PANJIT's M4 and M8 series bridge rectifiers are 1000 V standard diode rectifiers with A current range of 2 A to 10 A and excellent heat dissipation performance. They are designed with mist tin coating and glass passivated chip junction, are lead-free, comply with EU RoHS 2.0 standard, halogen-free, comply with IEC 61249 standard. The lead frame is designed to maximize chip pads and IFSM support for the same package size.

PANJIT products meet and exceed all industry requirements. M4 and M8 series use upgraded pads, SMD Gull wing packaging and solder paste printing instead of dispensing design in the solidification process to improve welding stability and reduce the cavity rate to less than 15%.

The M4 and M8 series are manufactured using a fully automated process that uses automatic laser die-cutting technology and automated pickup and placement of the chip mount to improve accuracy and prevent chip displacement, microcracks and fragmentation. These wafers are produced using SIPOS/PG/LTO technology to optimize HTRB capacity.

With the PANJIT bridge rectifier, the user can obtain the maximum forward current rating within the same package measurement range. Available in seven different packaging options, these bridge rectifier families are the best choice for applications requiring large current ratings and high power operation, such as industrial server power supplies, computing, desktop power supplies, game console power supplies, appliance power boards, rice cookers, microwave ovens, QC, USB PD, air conditioning power boards, etc.

Features

● Glass passivated chip junction
● Lead-free, compliant with EU RoHS 2.0
● The lead frame is designed to maximize chip pads and IFSM support for the same package size.
● No halogen, in accordance with IEC 61249 standards
● Mist tin coating
● Automatic laser die cutting technology
● Automatic pickup and placement of chip mounting improves accuracy and prevents chip displacement, microcracks and fragmentation
● Automatic test bar code system for PAT specification review
● Welding paste printing was used instead of dispensing during the patch process, which improved the welding stability and reduced the cavity rate to less than 15%
● SMD Gull Wing package
● Upgraded mold pad
● UL certification document number E526209
● Wafers produced using SIPOS/PG/LTO technology can optimize HTRB capacity

Applications

● Computing or desktop power
● Power supply for game console
● Server power supply
● Air-conditioning power supply panel
● QC/USB PD
● High power and high efficiency power supply
● Electrical appliance switchboard
● Rice cooker /IH/ microwave oven