Nordic Semiconductor introduces the CSP version of the nRF7002 Wi-Fi 6 Collaboration IC

     Nordic Semiconductor, the world's leading provider of low-power wireless iot connectivity solutions, announced the launch of a Wafer-Level Chip Scale package for its nRF7002 Wi-Fi 6 Companion IC Package, WLCSP) version. The new package option offers the same functionality as the nRF7002 QFN version, but with a more than 60% reduction in the base surface, making the WLCSP ideal for efficient, size-constrained designs for next-generation wireless devices.

     The nRF7002 WLCSP supports advanced Wi-Fi 6 features, including OFDMA and Target Wake Time (TWT), for robust and efficient wireless connectivity. The integrated circuit is optimized for ultra-low power operation, ensuring extended battery life for connected devices. Its smaller form factor provides developers with Wi-Fi solutions for space-constrained applications such as modules, wearables, and portable medical devices.

     The nRF7002 Wi-Fi 6 collaboration IC works with Nordic's award-winning nRF91 series Packaged System (SiP), nRF52 and nRF53 series multi-protocol System-on-Chip (SoC), and the upcoming nRF54L and nRF54H series SOCs Seamless integration. This integration ensures that developers can fully realize the potential of Wi-Fi 6, including higher data rates, greater capacity and improved energy efficiency, as well as Nordic's best-in-class LTE-M/NB-IoT and Bluetooth LE solutions. This simplifies the development process and speeds time to market.

     Joakim Ferm, Senior vice President of Wi-Fi BU at Nordic Semiconductor, said: "We are excited to introduce nRF7002 in the WLCSP package. The addition of this package to the nRF7002 series provides our customers with a versatile, compact solution to meet the growing demand for smaller, more power-efficient iot devices. This new version selection demonstrates our commitment to Wi-Fi and delivering innovative connectivity solutions that enable our customers to push the limits of wireless design."