NXP launches a new generation of JCOP Pay, enabling payment card customization

     NXP Semiconductors N.V., has announced JCOP Pay, which runs on JCOP 5 EMV, enabling a high degree of customer customization of payment cards while enhancing card information security. JCOP Pay, which runs on JCOP 5 EMV, has recently achieved EMVCo certification, helping customers achieve a long card issuance life cycle.

     Card inventory management is challenging for payment card manufacturers, who need the flexibility to adapt to the changing needs of consumers in a highly competitive industry. JCOP Pay, which runs on JCOP 5 EMV, can be reconfigured flexibly and securely before the card is issued to the end user, enabling changes to payment scheme applications and Settings. As a result, customers are able to manage inventory efficiently, meet specific multi-application requirements, obtain better customized solutions, and increase overall flexibility.

     "Customization and adaptability are critical for card issuers," said Christian Lackner, senior director of Secure Payments and Identity at NXP. The new generation of JCOP Pay offers a flexible and secure reconfiguration solution that enables customers to quickly adjust existing inventory to meet changing consumer needs, giving them the flexibility they need to succeed in a highly competitive industry."

     JCOP Pay provides off-the-shelf solutions for all major payment schemes, including the WLA standard from the White Label Alliance that supports the creation of payment schemes. JCOP Pay running on JCOP 5 EMV supports secure password sharing. Consumers can use the same card and PIN for multiple payment plans without compromising security.

     JCOP Pay running on the JCOP 5 EMV is now EMVCo ICCN certified until 2030 and is backward compatible with JCOP Pay running on the widely recognized JCOP 4 EMV. It supports elliptic curve encryption (ECC) cryptography algorithms for next generation EMV applications. In addition, JCOP Pay is optimized for traditional welding lines and inductive coupling, simplifying antenna tuning and improving card manufacturing yields.