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Molex introduces electrocredit enhanced zSFP+ SMT 20-way interconnect solution

Jan 19 2012 2012-01 Power Molex
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Molex introduces the enhanced Small Size Pluggable + (zSFP+) Surface Mount Technology (SMT) 20-way connector that delivers outstanding performance for high-speed telecommunications and data communications equipment. Designed specifically for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the new zSFP+ interconnect components are scalable for next generation applications and provide the best electromagnetic interference (EMI) and signal integrity (SI) margins in 10 and 16 Gbps channels.

     Molex introduces the enhanced Small Size Pluggable + (zSFP+) Surface Mount Technology (SMT) 20-way connector that delivers outstanding performance for high-speed telecommunications and data communications equipment. Designed specifically for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the new zSFP+ interconnect components are scalable for next generation applications and provide the best electromagnetic interference (EMI) and signal integrity (SI) margins in 10 and 16 Gbps channels.

     The backward compatible zSFP+ connector offers the same plug-in interface and EMI shield dimensions as the SFP+ connector, with preferential coupling design with in-molding technology and narrow-edge coupling masking and molded contact shapes for excellent signal, mechanical and electrical performance. At the same time, compared with the current SFP+ products, the resonance is greatly reduced. Components of the new zSFP+ interconnect system include zSFP+ SMT 20-way connectors, stacked integrated connectors, and passive optical cable components.

     Joe Dambach, New product Development Manager at Molex, said: "SFP connectors and laminated integrated connectors have made major design improvements to achieve and optimize performance for next-generation applications. In central offices and multi-platform data systems, the new zSFP+ SMT technology provides a fully integrated solution for upgrades and designs for memory, switches, routers and hubs."

     The zSFP+ SMT 20-way connector has the same PCB footprint, plug-in interface, and EMI shield size, and can be used as a drop-in alternative to current SFP+ form-factor motherboard designs for full backward compatibility. Its high-temperature thermoplastic housing can withstand lead-free processes, and single-port and 1x ganged shielding supports multiple port number applications and options at a cost comparable to SFP+ shielding, and can be shared with different board thicknesses and assembly processes to meet server and switch application requirements. The modular shield is available with two, four or six ports for a variety of design options.

     Laminated integrated connectors and shields can be used in push-down applications, eliminating reflux assembly and offering a space-saving compact design for easy machining. Internal longitudinal shielding provides unmatched EMI reduction performance. The push-down tail is suitable for belly-to-belly applications and is used for single and group adjustment shields to maximize space use of printed circuit boards (PCBS). Optional rear - and side-mounted light guide cover assemblies allow for flexible routing of the LED's PCB signal, providing the user with feedback on port status and activity.

     The Molex Fiber LC twin-core cable assembly with OM3/OM4 fiber uses the zSFP+ optical module to provide a high-performance interconnect solution with custom length options and strain relief bushings including straight, 45 and 90 degree angles. The LC twin-core connector using OM3/OM4 fiber provides the higher transmit bandwidth required for next-generation zSFP+ devices, which meets EIA-TIA and FOCIS 10 standards and is suitable for MSA devices.

     Dambach added, "The enhanced zSFP+ connector products provide an excellent plug-in component for emerging 25 Gbps designs, and Molex customers have already benefited from the additional signal integrity margin gained by implementing the enhanced zSFP+ solution on today's low-speed boards."

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