Micron's low-power memory solution powers Qualcomm's second-generation Snapdragon XR2 platform

     Micron Technology announced, Its low-power LPDDR5X DRAM and general-purpose flash UFS 3.1 embedded solutions have now been validated by Qualcomm Technologies, Inc. 's latest Extended Reality (XR) platform, the second-generation Snapdragon ™ XR2. Micron LPDDR5X and UFS 3.1 are compact and offer higher speeds, improved performance, and lower power consumption for flexible support of mixed reality (MR) and virtual reality (VR) devices. The LPDDR5X is Micron's most advanced low-power memory, enabling lower power consumption through innovative 1α process node technology and JEDEC energy efficiency optimization.

     The global augmented reality (AR) and virtual reality (VR) market size is growing at a CAGR of 24% from 2021 [] and is expected to reach $200 billion by 2030. Micron embedded products provide powerful ready-to-use solutions for extended reality applications, accelerating consumer adoption and expanding market potential. Micron LPDDR5X and UFS 3.1 enable parallel processing across multiple applications and sensors to create a truly immersive experience for VR users by seamlessly integrating changing forms, locations, and perceptions in the meta-universe.

     The Micron LPDDR5X enables peak rates of up to 8.533 Gbps while being backward compatible with LPDDR5 at 6.4 Gbps, providing device manufacturers with flexibility for platform integration while reducing power consumption.

     Chris Jacobs, vice president and general manager of Embedded markets at Micron, said: "The meta-universe holds enormous potential to revolutionize the way we work and play. To turn this innovation into reality, we need high-performance, low-power hardware to meet the super-fast speeds demanded by mixed reality experiences. Micron LPDDR5X and UFS 3.1 solutions are ideal for the next generation of XR devices, delivering the performance and power needed to unlock rich virtual world experiences."

     The second-generation Snapdragon XR2 processor, recently announced on September 27, has been developed in close collaboration with Meta and has been commercially available for the first time on Meta's newly launched headset Meta Quest 3. The second-generation Snapdragon XR2 platform offers a single-chip architecture that enables new immersive MR And VR experiences in thinner, more comfortable headsets that don't require an external battery pack. The Meta Quest 3 spatial computing platform delivers a delayless experience with stunning visuals and immersive sound effects, allowing users to feel the integration of virtual content with the real world, and enabling seamless transitions between MR And VR experiences.

     The LPDDR5X reduces power consumption by 24% compared to the previous generation [] and achieves a better user experience by extending battery life, making it ideal for MR And VR headsets. The Micron LPDDR5X achieves a peak data transfer rate of 8.533 Gbps, which improves data access speed by 33% for metacomph applications [], thereby reducing response times. Micron's 1α-based LPDDR5X memory delivers enhanced capacity density, performance and energy efficiency for extended reality devices.

     The Micron UFS 3.1 client storage is the world's first UFS to feature Micron's 176-layer NAND technology, featuring a compact form factor and high storage density that provides greater design flexibility for small devices such as MR And VR headsets.